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	Heat transfer of heat sink encapsulated with phase change material to prevent temperature from rising for electronic devices
	Lu Tao ; Jiang Pei-xue
	2010-05-11 ; 2010-05-11
关键词	Practical/ cooling encapsulation heat sinks phase change materials thermal stability/ heat transfer heat sink phase change material electronic devices thermal storage system natural convection cooling/ B0170J Product packaging
中文摘要	A huge amount of heat is generated due to increase electric current. Thermal storage system with solid-liquid phase change is used to keep temperature of the electronic device stable; thereby the goal of protection from high temperature is achieved. Theoretical analysis of heat transfer of heat sink encapsulated with phase change material (PCM) under the cooling of natural convection is completed. The average temperature of heat sink, PCM, and air and the process of phase change of PCM are obtained. The time of protection from high temperature and the characteristic of convective heat transfer are analyzed contrastively under different heat flux for the same heat sink and cooling condition.
语种	中文 ; 中文
出版者	Editorial Dept. of the Chinese J. Electron Devices ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/25928]
专题	清华大学
推荐引用方式 GB/T 7714	Lu Tao,Jiang Pei-xue. Heat transfer of heat sink encapsulated with phase change material to prevent temperature from rising for electronic devices[J],2010, 2010.
APA	Lu Tao,&Jiang Pei-xue.(2010).Heat transfer of heat sink encapsulated with phase change material to prevent temperature from rising for electronic devices..
MLA	Lu Tao,et al."Heat transfer of heat sink encapsulated with phase change material to prevent temperature from rising for electronic devices".(2010).

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