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浏览/检索结果: 共7条，第1-7条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology 其他 2014-01-01 Xu, Yichao; Miao, Min; Fang, Runiu; Sun, Xin; Zhu, Yunhui; Sun, Minggang; Wang, Guanjiang; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production 其他 2014-01-01 Fang, Runiu; Miao, Min; Sun, Xin; Zhu, Yunhui; Wang, Guanjiang; Xu, Yichao; Sun, Minggang; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他 2014-01-01 Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 SEGMENTATION METHOD  3-D ICS  SILICON  TSV   Investigations of Silicon Wafer Bonding Using Thin Al and Sn Films for Heterogeneous Integration 其他 2013-01-01 Zhu, Zhiyuan; Wang, Shaonan; Xu, Yichao; Wang, Guanjiang; Pi, Yudan; Wang, Peiquan; Zhu, Yunhui; Sun, Xin; Yu, Min; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13 Wafer bonding  heterogeneous integration  Al  Sn  MEMS  DEVICES   Design and Fabrication of a TSV Interposer for SRAM Integration 其他 2011-01-01 Zhu, Yunhui; Ma, Shenglin; Cui, Qinghu; Kang, Wenping; Zhu, Zhiyuan; Sun, Xin; Wang, Guanjiang; Zhang, Mengmeng; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Xu, Yichao[1,3];  Miao, Min[1,2];  Fang, Runiu[1];  Sun, Xin[1];  Zhu, Yunhui[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/12 Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Fang, Runiu[1];  Miao, Min[2];  Sun, Xin[1];  Zhu, Yunhui[1];  Wang, Guanjiang[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/12