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	Design and Fabrication of a TSV Interposer for SRAM Integration
	Zhu, Yunhui ; Ma, Shenglin ; Cui, Qinghu ; Kang, Wenping ; Zhu, Zhiyuan ; Sun, Xin ; Wang, Guanjiang ; Zhang, Mengmeng ; Chen, Jing ; Miao, Min ; Jin, Yufeng
	2011
英文摘要	TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple fabrication process is developed for cost-sensitive application. The mushroom-like Cu/Sn bumps by copper overburden can be directly connected with other substrate, which eliminates a CMP planarization to improve the yield and reduce fabrication cost. The electrical and thermal-mechanical behaviors of the 3D system were analyzed. Preliminary fabrication results are demonstrated. The TSV interposer technology is promising for 3D SRAM integration.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000309781000008&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/ICEPT.2011.6066784
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/406076]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhu, Yunhui,Ma, Shenglin,Cui, Qinghu,et al. Design and Fabrication of a TSV Interposer for SRAM Integration. 2011-01-01.

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