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上海大学 [27]
重庆大学 [5]
河南大学 [5]
华南理工大学 [2]
新疆农业大学 [2]
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会议论文 [22]
期刊论文 [19]
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2017 [10]
2016 [17]
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2014 [3]
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浏览/检索结果:
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The influence of sintering process on thermal properties of nano-silver paste
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Lu, Xiuzhen[1]
;
Zhang, Qianran[2]
;
Zehri, Abdelhafid[3]
;
Ke, Wei[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2019/04/22
Thermal conductivity
Sintering temperature
sintering time
nano-silver paste
SiC particles
Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
期刊论文
SMALL, 2018, 卷号: 14, 页码: e1801346
作者:
Wang, Nan[1]
;
Samani, Majid Kabiri[2]
;
Li, Hu[3]
;
Dong, Lan[4]
;
Zhang, Zhongwei[5]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/22
grain size
graphene films
phonon transfer
thermal conductivity
turbostratic-stacking
Conductivity Enhancement of PEDOT:PSS via Addition of Chloroplatinic Acid and Its Mechanism
期刊论文
2017, 卷号: 3
作者:
Wu, Falin[1]
;
Li, Pengcheng[2]
;
Sun, Kuan[1]
;
Zhou, Yongli[1]
;
Chen, Wei[1,3]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/11/28
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Chen, Shujing[1]
;
Shan, Bo[2]
;
Yang, Yiqun[3]
;
Yuan, Guangjie[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Interconnect
CNTs based bumps
CNTs basednTSVs
resistivity
CNTs-Cu nanocomposite
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Huang, Shirong[1]
;
Ke, Wei[2]
;
Yang, Yiqun[3]
;
Ye, Hui[4]
;
Chen, Shujing[5]
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2019/04/24
Graphene protection barrier
Cu-Plated PCB
Reliability
Effect of sintering method on properties of nanosilver paste
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Zhang, Qiaoran[1]
;
Liu, Jiawen[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Latorre, Marti Gutierrez[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/24
nanosilver
sintering
thermal conductivity
shear strength
Graphene-based Heat Spreading Materials for Electronics Packaging Applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yuan, Guangjie[1]
;
Shan, Bo[2]
;
Chen, Shujing[3]
;
Yang, Yiqun[4]
;
Bao, Jie[5]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/24
heat spreading materials
graphene-based film
graphene-based electrically conductive adhesive
electronics packaging
Metastatic tumor of male genital system from gastric cancer: a case report and review of literature
期刊论文
INTERNATIONAL JOURNAL OF CLINICAL AND EXPERIMENTAL PATHOLOGY, 2017, 卷号: 10, 页码: 8592-8598
作者:
Dai, Weigang[1,3]
;
Liu, Dawei[2]
;
Zuo, Jidong[1,3]
;
Tan, Jinfu[1,3]
;
Wang, Liang[1,3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/24
Spermatic cord metastasis
gastric cancer
signet-ring cell
adenocarcinoma
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yang, Yiqun[1]
;
Ye, Hui[2]
;
Ke, Wei[3]
;
Huang, Shirong[4]
;
Wang, Nan[5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/24
heat dissipation
silver coated graphene
electrically conductive adhesive
Experimental throughfall reduction barely affects soil carbon dynamics in a warm-temperate oak forest, central China
期刊论文
SCIENTIFIC REPORTS, 2017, 卷号: 7, 期号: 1, 页码: 15099
作者:
Lu, Haibo[1]
;
Liu, Shirong[2]
;
Wang, Hui[3]
;
Luan, Junwei[4]
;
Schindlbacher, Andreas[5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/23
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