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	Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging
	Yang, Yiqun[1]; Ye, Hui[2]; Ke, Wei[3]; Huang, Shirong[4]; Wang, Nan[5]; Lu, Xiuzhen[6]; Bao, Jie[7]; Ye, Lilei[8]; Liu, Johan[9]
	2017
会议名称	2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC)
会议日期	2017-01-01
关键词	heat dissipation silver coated graphene electrically conductive adhesive
页码	125-128
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2182300
专题	上海大学
作者单位	1.[1]Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 2.[2]Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 3.[3]Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 4.[4]Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 5.[5]Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, Elect Mat & Syst Lab, SE-41296 Gothenburg, Sweden. 6.[6]Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 7.[7]Huangshan Univ, Sch Mech & Elect Engn, Huangshan 245041, Peoples R China. 8.[8]SHT Smart High Tech AB, Aschebergsgatan 46, SE-41133 Gothenburg, Sweden. 9.[9]Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai, Peoples R China. 10.Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, Elect Mat & Syst Lab, SE-41296 Gothenburg, Sweden.
推荐引用方式 GB/T 7714	Yang, Yiqun[1],Ye, Hui[2],Ke, Wei[3],et al. Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging[C]. 见:2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC). 2017-01-01.

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