中国开放科研知识云: 检索

验证码:

换一张

忘记密码？记住我

取消登录

CORC

首页
科研机构
检索
知识图谱
申请加入
托管服务

在结果中检索

科研机构

山东大学 [86]

大连理工大学 [45]

工程热物理研究所 [33]

武汉大学 [20]

中国医学科学院北... [17]

北京航空航天大学 [15]

内容类型

期刊论文 [272]

会议论文 [45]

无文献类型 [40]

发表日期

学科主题

环境及其它 [3]

材料科学与物理化学 [2]

石油工程多相流 [2]

Acoustic W... [1]

Astronomy ... [1]

知识图谱

CORC

已提交作品

待认领作品

已认领作品

未提交全文

浏览/检索结果: 共385条，第1-10条

帮助

已选(0)清除条数/页：排序方式：
	Improving the lubricating performance of Ga-based liquid metal doped by silver 期刊论文 Tribology International, 2022, 卷号: 171 作者: Ma, Jiqiang; Liu, Chen; Chen, Wenyuan; Chen, Juanjuan; Li, Qinglin 收藏 \| 浏览/下载：16/0 \| 提交时间：2022/04/21 Friction Oscillators (electronic) Silver alloys Wear of materials Coolant and lubricant Friction and wear Ga-based liquid metal Highest temperature Lubricating performance Lubricating properties Lubrication / Mechanical systems Metal-doped Nuclear plant
	The facilities and performance of TianQin laser ranging station 期刊论文 CLASSICAL AND QUANTUM GRAVITY, 2022, 卷号: 39, 期号: 12 作者: Zhang, Caishi; Gao, Tianquan; Cao, Yuyan; Fan, Zhongwei; Fu HL(伏红林) 收藏 \| 浏览/下载：52/0 \| 提交时间：2022/06/13 lunar laser ranging satellite laser ranging precision satellite orbit determination gravitational waves detection
	Improving the lubricating performance of Ga-based liquid metal doped by silver 期刊论文 Tribology International, 2022, 期号: 171, 页码: 107520 作者: Ma, Jiqiang; Liu, Chen; Chen, Wenyuan; Chen, Juanjuan; Li, Qinglin 收藏 \| 浏览/下载：3/0 \| 提交时间：2022/12/15
	Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：16/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion barriers Gold Gold compounds Heat resistance Microstructure Nickel Open circuit voltage Soldering Barrier films Diffusion barrier films Electrical resistances Output current Reflow--soldering Solder joints Temperature differences Thermoelectric
	Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：21/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion Electric resistance Electrodes Growth rate IV-VI semiconductors Microstructure Scanning electron microscopy Tin Tin compounds Transmission electron microscopy Diffusion process Electrical resistances Micro-structure evolutions Porous structures Thermodynamically stable Thermoelectric Volume diffusion X ray diffractometers
	Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者: Cheng, Jinxuan; Hu, Xiaowu; Zhang, Zhe; Li, Qinglin 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Binary alloys Diffusion Growth rate Soldering Atomic diffusions Compound layer Diffusion channels Diffusion process Micro-structure evolutions Plating thickness Solder joint reliability Solder joints
	Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文 Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin; Jiang, Xiongxin 收藏 \| 浏览/下载：4/0 \| 提交时间：2020/11/14 Ductile fracture Microstructure Soldering Fracture mechanisms IMC layer Liquid-state reaction Micro-structure evolutions Ni additions Reflow--soldering Solder joints Synergistic effect
	Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Crystal orientation Deterioration Electrodes Substrates Thermoelectric equipment Aging treatment Brittle failures Cu electrodeposits Interfacial contact Isotropic microstructures Solder joints Spreadability Thermo-Electric materials
	Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：7/0 \| 提交时间：2019/11/15
	Effects of different crystalline iron oxides on immobilization and bioavailability of Cd in contaminated sediment 期刊论文 Chemical Engineering Journal, 2019, 卷号: Vol.373, 页码: 307-317 作者: Xue-cheng Li; Zhong-zhu Yang; Chang Zhang; Jing-jing Wei; Hua-qing Zhang 收藏 \| 浏览/下载：55/0 \| 提交时间：2019/12/17 Sediment Iron oxides Cd immobilization Bioavailability Chemical speciation Fe dissolution risk

相关链接
欧盟学术资源开放存取平台
CALIS高校机构知识库
台湾学术机构典藏
香港机构知识库整合系统
中国科学院机构知识库网格系统

CORC
关于我们
服务条款
隐私条款

联系我们
0931-8270076
cspace@llas.ac.cn
China-OR

中文简体

©版权所有 ©2017 CSpace - Powered by CSpace