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浏览/检索结果: 共7条，第1-7条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 TSV  3D packaging  sidewall insulation  electrical properties  CMP  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他 2016-01-01 Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 THROUGH-SILICON VIAS   Modeling and analysis of TSV noise coupling and suppression methods for 20nm node and beyond 其他 2014-01-01 Fang, Runiu; Sun, Xin; Jin, Yufeng; Miao, Min 收藏  |  浏览/下载：6/0  |  提交时间：2015/11/17 FEM simulation of the thermo-mechanical behavior of TSV 3D MEMS structure 其他 2013-01-01 Gong, Xin; Chen, Jing; Lee, JongHo 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16 FEM simulation  thermo-mechanical  Though Silicon Via (TSV)  3D MEMS   Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Jin, Yufeng[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 TSV  3D packaging  sidewall insulation  electrical properties  CMP