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CORC

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Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C 期刊论文
Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629
作者:  Sui, Ran;  Tan, Kaihui;  Lin, Qiaoli;  Xie, Kaibin
收藏  |  浏览/下载：21/0  |  提交时间：2022/08/09
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration 期刊论文
Materials and Design, 2018, 卷号: 150, 页码: 9-16
作者:  Yu, Weiyuan;  Liu, Yun;  Liu, Xinya
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration 期刊论文
MATERIALS & DESIGN, 2018, 卷号: 150, 页码: 9-16
作者:  Yu, Weiyuan;  Liu, Yun;  Liu, Xinya
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/15
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal 期刊论文
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2017, 卷号: 26, 页码: 5137-5145
作者:  Chen, Biqiang;  Zhang, Guifeng;  Zhang, Linjie;  Xu, Tingting
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/26
Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler (EI收录) 期刊论文
Materials Science and Engineering A, 2017, 卷号: 680, 页码: 317-323
作者:  Cheng, L.X.[1];  Liu, M.R.[2];  Wang, X.Q.[3];  Yan, B.H.[1];  Li, G.Y.[4]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24
Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount 专利
专利号: US8821042, 申请日期: 2014-09-02, 公开日期: 2014-09-02
作者:  SATO, SHUNSUKE
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/24
System-in-package solution for a low-power active electrode module 会议论文
36th Annual International Conference of the IEEE-Engineering-in-Medicine-and-Biology-Society (EMBC), Chicago, IL
作者:  Nikolas Gai;  Linping Gao;  Jinhe Cai;  Jinyong Zhang;  Lei Wang
收藏  |  浏览/下载：16/0  |  提交时间：2015/09/02
Characteristics of a new non-rosin, lead-free solder paste activity system 其他
2011-01-01
Wang, Cuiping; Wang, Jian; Wang, Juan; Chen, Liang; Liu, Xingjun; 王翠萍; 刘兴军
收藏  |  浏览/下载：7/0  |  提交时间：2015/07/22
Facile conversion of silicon nitride nanobelts into sandwich-like nanosaws II: growth mechanism and optical properties 期刊论文
2010, 2010
Guo, Gang Feng; He, Mingsheng; Kong, Xiang Yang; Lin, Hong; Li, Jianbao; Fan, Li-Zhen
收藏  |  浏览/下载：2/0

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