| High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal | |
| Chen, Biqiang; Zhang, Guifeng; Zhang, Linjie; Xu, Tingting | |
| 刊名 | JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
 |
| 2017 | |
| 卷号 | 26页码:5137-5145 |
| 关键词 | aluminum matrix composites intergranular penetration and spreading active soldering runout |
| ISSN号 | 1059-9495 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2941487 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Chen, Biqiang,Zhang, Guifeng,Zhang, Linjie,et al. High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal[J]. JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE,2017,26:5137-5145. |
| APA | Chen, Biqiang,Zhang, Guifeng,Zhang, Linjie,&Xu, Tingting.(2017).High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal.JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE,26,5137-5145. |
| MLA | Chen, Biqiang,et al."High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal".JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE 26(2017):5137-5145. |
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