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金属研究所 [3]
厦门大学 [2]
兰州理工大学 [2]
清华大学 [1]
大连理工大学 [1]
西安光学精密机械研究... [1]
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期刊论文 [7]
专利 [1]
其他 [1]
学位论文 [1]
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2018 [4]
2011 [1]
2010 [1]
2009 [1]
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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:
Huang, Ru
;
Ma, Haoran
;
Shang, Shengyan
;
Kunwar, Anil
;
Wang, Yunpeng
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2019/12/02
Chip scale packages
Copper
Copper alloys
Flip chip devices
Grain boundaries
Growth rate
Size determination
Soldered joints
Substrates
Tin alloys, Electronic product
Grain boundary motions
Interface reactions
Lateral growth rates
Longitudinal growth
Packaging process
Packaging technologies
Solder composition, Soldering
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration
期刊论文
Materials and Design, 2018, 卷号: 150, 页码: 9-16
作者:
Yu, Weiyuan
;
Liu, Yun
;
Liu, Xinya
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2022/02/17
Aluminum alloys
Drops
Graphite
High speed cameras
Oxide films
Silver alloys
Soldering
Temperature
Ternary alloys
Tin alloys
Titanium alloys
Transmissions
Ultrasonic effects
Ultrasonic waves
Vibration analysis
Wave transmission
Active solder
Atmospheric conditions
Spreading
Spreading characteristics
Spreading distances
Ultrasonic amplitude
Ultrasonic attenuation
Ultrasonic vibration
Spreading of Sn-Ag-Ti and Sn-Ag-Ti(-Al) solder droplets on the surface of porous graphite through ultrasonic vibration
期刊论文
MATERIALS & DESIGN, 2018, 卷号: 150, 页码: 9-16
作者:
Yu, Weiyuan
;
Liu, Yun
;
Liu, Xinya
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/11/15
Graphite
Active solder
Spreading
Ultrasonic-assisted soldering
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
作者:
Xu Zhiwu
;
Li Zhengwei
;
Luo Xiaoyu
;
Ji Shude
;
Yan Jiuchun
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2021/02/02
ultrasonic soldering
spreading frontier
oxide film
finite element simulation
elimination measure
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
作者:
Xu Zhiwu
;
Li Zhengwei
;
Luo Xiaoyu
;
Ji Shude
;
Yan Jiuchun
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2021/02/02
ultrasonic soldering
spreading frontier
oxide film
finite element simulation
elimination measure
Characteristics of a new non-rosin, lead-free solder paste activity system
其他
2011-01-01
Wang, Cuiping
;
Wang, Jian
;
Wang, Juan
;
Chen, Liang
;
Liu, Xingjun
;
王翠萍
;
刘兴军
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2015/07/22
Characterization
Gravimetric analysis
Lead compounds
Packaging
Soldering
Thermogravimetric analysis
Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy
期刊论文
2010, 2010
Chen Guohai
;
Ma Jusheng
;
Geng Zhiting
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  |  
浏览/下载:7/0
Sn基多组元高温无铅焊接材料的设计及性能研究
学位论文
2009, 2009
李元源
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  |  
浏览/下载:3/0
  |  
提交时间:2016/02/14
高温无铅焊接材料
相图计算
界面反应
High temperature lead-free solder
CALPHAD
Interfacial reaction
Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath
期刊论文
ACTA METALLURGICA SINICA, 2004, 卷号: 40, 期号: 8, 页码: 822-826
作者:
Qiao, M
;
Xian, AP
;
Shang, JK
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2021/02/02
lead-free solder
electroplating
Sn-Ag alloy
microelectronic packaging
Robust spectroscopic optical probe
专利
专利号: EP0829027B1, 申请日期: 1999-01-27, 公开日期: 1999-01-27
作者:
BUCHANAN, NORMA, LINDSEY
;
ALSMEYER, DANIEL, CHARLES
;
NELSON, GREGORY, WAYNE
;
EDWARDS, ROGER, DALE
;
NICELY, VINCENT, ALVIN
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/24
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