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CORC

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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09
Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484
作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin
收藏  |  浏览/下载：28/0  |  提交时间：2022/03/01
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ
收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
High Frequency Induction Brazing Process of Copper-Steel and Its Effects on Microstructure and Electrical Conductivity of Weld Joint 期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 3, 页码: 909-914
作者:  Shi, Yu;  Gao, Haiming;  Li, Guang;  Li, Xiang
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li
收藏  |  浏览/下载：24/0  |  提交时间：2017/08/17
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.
收藏  |  浏览/下载：9/0  |  提交时间：2017/12/25
Properties and Microstructures of Sn-Bi-X Lead-Free Solders 期刊论文
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2016, 页码: 15
作者:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su-juan;  Ma, Jia
收藏  |  浏览/下载：2/0  |  提交时间：2021/02/02
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
H. Zhang; Q. S. Zhu; Z. Q. Liu; L. Zhang; H. Y. Guo; C. M. Lai
收藏  |  浏览/下载：24/0  |  提交时间：2015/01/14

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