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CORC

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Recycling of diamond-wire sawing silicon powder by direct current assisted directional solidification 期刊论文
WASTE MANAGEMENT, 2023, 卷号: 157, 页码: 190-198
作者:  Hu, Zhiqiang;  Wang, Guoliang;  Li, Jiayan;  Tan, Yi;  Liu, Yao
收藏  |  浏览/下载：17/0  |  提交时间：2023/02/01
Compositional optimization of high-solid-loading ceramic cores via 3D printing 期刊论文
ADDITIVE MANUFACTURING, 2022, 卷号: 58, 页码: 15
作者:  An, Xiaolong;  Mu, Yahang;  Chen, Jiawang;  Liang, Jingjing;  Li, Jinguo
收藏  |  浏览/下载：17/0  |  提交时间：2022/09/16
High sensitivity active adjustable graphene absorber for refractive index sensing applications 期刊论文
Diamond and Related Materials, 2022, 卷号: 128
作者:  Shangguan, Qianyi;  Zhao, Yong;  Song, Zijun;  Wang, Jian;  Yang, Hua
收藏  |  浏览/下载：25/0  |  提交时间：2022/08/09
Improvements in Brazed-Joint Properties of Silicon Nitride and Titanium Alloys Using Laser-Induced Microscale Rice Leaf Structures 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 19
作者:  He, Jian-Guo;  Dai, Shou-Jun;  Zhao, Yang;  Huang, Min;  Liu, Yang
收藏  |  浏览/下载：22/0  |  提交时间：2022/10/28
Evaporative Deposition of Surfactant-Laden Nanofluid Droplets over a Silicon Surface 期刊论文
LANGMUIR, 2022
作者:  Yu, Ying-Song;  Yang, Xiao-Ye;  Li, Guo-Hao;  Huang XF(黄先富)
收藏  |  浏览/下载：16/0  |  提交时间：2022/10/23
Space-confined fabrication of hydrophobic magnetic carbon nanofibers for lightweight and enhanced microwave absorption 期刊论文
Carbon, 2022, 卷号: 197, 页码: 544-554
作者:  Shen, Yongqian;  Zhang, Fan;  Zhang, Yuchen;  Song, Pengfei;  Gao, Feng
收藏  |  浏览/下载：40/0  |  提交时间：2022/08/09
Influence of the SEI Formation on the Stability and Lithium Diffusion in Si Electrodes 期刊论文
ACS OMEGA, 36, 2022, 卷号: 7, 页码: 2147483647
作者:  Wu, Baolin;  Chen CG(陈春光);  Danilov, Dmitri L.;  Jiang, Ming;  Raijmakers, Luc H. J.
收藏  |  浏览/下载：20/0  |  提交时间：2022/10/23
Purification of Quartz Via Low-Temperature Microwave Chlorinated Calcination Combined with Acid Leaching and its Mechanism 期刊论文
SILICON, 2022
作者:  Song, Wangfeng;  Jiang, Xuesong;  Chen, Chen;  Ban, Boyuan;  Wan, Songming
收藏  |  浏览/下载：13/0  |  提交时间：2022/12/23
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09
Mid-Infrared Graphene/Silicon-Based Electro-Optic Phase Modulator 预印本
2022
作者:  Ban, Xiaoqiang;  Dong, Bo;  Chen, Zongyu;  Huang, Wobin;  Zhong, Ming
收藏  |  浏览/下载：14/0  |  提交时间：2022/08/31

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