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CORC

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Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 140, 页码: 60-67
作者:  Long X;  Tang WB;  Feng YH(冯义辉);  Chang C;  Keer LM
收藏  |  浏览/下载：35/0  |  提交时间：2018/07/17
Flexible electronic circuits with embedded integrated circuit die 专利
专利号: US9899330, 申请日期: 2018-02-20, 公开日期: 2018-02-20
作者:  DALAL, MITUL;  GUPTA, SANJAY
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载：32/0  |  提交时间：2017/01/15
Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Rong Sun
收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15
Electrically conductive adhesives based on thermoplastic polyurethane filled with silver flakes and carbon nanotubes 期刊论文
COMPOSITES SCIENCE AND TECHNOLOGY, 2016, 卷号: 129
作者:  Luo, J;  Cheng, ZJ;  Li, CW;  Wang, LJ;  Yu, CP
收藏  |  浏览/下载：27/0  |  提交时间：2017/03/11
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016-01-01
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Liu, Qianqian;  Hu, Yougen
收藏  |  浏览/下载：7/0  |  提交时间：2020/01/03
The Application of Nano Carbon Based Materials in Electrical Conductive Adhesives 期刊论文
PROGRESS IN CHEMISTRY, 2015, 卷号: 27, 期号: 9, 页码: 1158-1166
作者:  Luo Jie;  Li Chaowei;  Lan Zhuyao;  Chen Minghai;  Yao Yagang
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15

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