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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Wetting of liquid aluminum alloys on pure titanium at 873-973 K 期刊论文 Journal of Materials Research and Technology, 2019, 卷号: 8, 期号: 6, 页码: 5813-5822 作者:  Jin, Peng;  Liu, Yibo;  Sun, Qingjie;  Lin, Qiaoli;  Li, Junzhao 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Activation energy  Binary alloys  Drops  Intermetallics  Mass transfer  Oxide films  Silicon compounds  Titanium  Titanium dioxide  Wetting  Decomposition energy  Empirical equations  Gibbs energy of formation  Interfacial mass transfer  Intermetallic layer  Sessile drop method  Spreading dynamics  Viscous dissipation   Influence of Brazing Filler Zn on Microstructure and Properties of Titanium/Aluminum Joint by Friction Stir Brazing 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 9, 页码: 3067-3071 and 3100 作者:  Wu, Jingwei;  Zhang, Zhongke;  Che, Pengwei 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Aluminum compounds  Binary alloys  Brazing  Ductile fracture  Fillers  Friction  Friction stir welding  Intermetallics  Microstructure  Scanning electron microscopy  Spectrometers  Temperature distribution  Temperature measurement  Ternary alloys  Titanium compounds  Zinc  Zinc alloys  Brazing fillers  Cross section microstructure  Energy dispersive spectrometers  Friction stir  Highest temperature  Microstructure and properties  Peak temperatures  TC4 and Al6082   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Microstructure and Mechanical Property of Arc-assisted Laser Welding-brazing Butt Joint of Aluminum and Steel 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 8, 页码: 2479-2482 作者:  Yu, Xiaoquan;  Fan, Ding;  Huang, Jiankang;  Li, Chunling 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Aluminum coated steel  Aluminum compounds  Binary alloys  Brazing  Butt welding  Fracture  Fracture mechanics  Grain boundaries  Intermetallics  Iron compounds  Mechanical properties  Microstructure  Welds  Effect factors  Fe intermetallics  Formation of weld  Fracture behavior  Fracture location  Laser welding-brazing  Microstructure and mechanical properties  Tensile mechanical properties   Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668 作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Bismuth alloys  Copper  Copper oxides  Joining  Oxide films  Phase interfaces  Soldering  Ternary alloys  Tin compounds  Wetting  Cu intermetallics  IMC layer  Interfacial reactivity  Interfacial structures  Sessile drop method  Sn-Bi alloy  Spreading characteristics  Ternary phase diagrams   Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Binary alloys  Geometry  Intermetallics  Lead-free solders  Morphology  Polychlorinated biphenyls  Silver compounds  Soldered joints  Tin alloys  Aging time  Compressive strain  Enhanced effects  Growth of intermetallics  Kirkendall void  Mean diameter  Polyhedron shapes  Solder joints   Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771 作者:  Yu, Wei-Yuan;  Liu, Ying-Zong;  Wu, Wei-Jie;  Li, Fu-Xiang;  Xing, Chun-Xiao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Binary alloys  Brazing  Copper compounds  Diffusion  Dissolution  Intermetallics  Lead-free solders  Phase interfaces  Tin alloys  Tin compounds  Cu-Sn intermetallics  Dissolution model  Evolution of the microstructure  Formation and evolutions  Formation mechanism  Planar shape  Soldering process  Solid-liquid interfaces   Acid-tolerant intermetallic cobalt-nickel silicides as noble metal-like catalysts for selective hydrogenation of phthalic anhydride to phthalide 期刊论文 CATALYSIS SCIENCE & TECHNOLOGY, 2019, 卷号: 9, 页码: 1108-1116 作者:  Zhang, Liangliang;  Chen, Xiao;  Chen, Yujing;  Peng, Zhijian;  Liang, Changhai 收藏  |  浏览/下载：31/0  |  提交时间：2019/12/02 Acid resistance  Chemical vapor deposition  Cobalt  Corrosion resistance  Hydrogenation  Intermetallics  Nickel  Nickel compounds  Precious metals  Silicides, Activity measurements  Chemoselective hydrogenation  Intermetallic compound catalysts  Microwave assisted chemical vapor depositions  Noble metal catalysts  Phthalic anhydrides  Selective hydrogenation  Transition metal catalysts, Catalyst activity