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科研机构
大连理工大学 [9]
内容类型
会议论文 [5]
期刊论文 [4]
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2018 [2]
2017 [1]
2015 [2]
2014 [4]
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专题:大连理工大学
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Manipulating Luminescence of Light Emitters by Photonic Crystals
期刊论文
ADVANCED MATERIALS, 2018, 卷号: 30, 页码: e1803362
作者:
Wu, Suli
;
Xia, Hongbo
;
Xu, Jiahui
;
Sun, Xiaoqian
;
Liu, Xiaogang
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/02
light emitters
local density of optical states
luminescence
nanostructure
photonic crystals
A novel long-side-chain sulfonated poly(2,6-dimethyl-1,4-phenylene oxide) membrane for vanadium redox flow battery
期刊论文
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2018, 卷号: 43, 页码: 301-310
作者:
Yan, Xiaoming
;
Sun, Jiahui
;
Gao, Li
;
Zheng, Wenji
;
Dai, Yan
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Cation exchange membrane
PPO
Long side chain
Vanadium redox flow battery
Microphase separation
Integrated network analysis reveals potentially novel molecular mechanisms and therapeutic targets of refractory epilepsies
期刊论文
PLOS ONE, 2017, 卷号: 12, 页码: e0174964
作者:
Chu, Hongwei
;
Sun, Pin
;
Yin, Jiahui
;
Liu, Guangming
;
Wang, Yiwei
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
Modeling the Diffusion-Driven Growth of a Pre-Existing Gas Bubble in Molten Tin
期刊论文
METALS AND MATERIALS INTERNATIONAL, 2015, 卷号: 21, 页码: 962-970
作者:
Kunwar, Anil
;
Ma, Haitao
;
Sun, Junhao
;
Li, Shuang
;
Liu, Jiahui
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/09
bubble
metals
soldering
diffusion
synchrotron radiation
Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint
会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:
Guo, Bingfeng
;
Kunwar, Anil
;
Ma, Haoran
;
Liu, Jiahui
;
Li, Shuang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/09
IMC
morphology
cooling
temperature
synchrotron radiation
In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction
会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:
Sun, Junhao
;
Du, Yao
;
Kunwar, Anil
;
Qu, Lin
;
Li, Shuang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/09
bubbles
intermetallic compound
Interfacial reaction
Diffusion
Dissolution
Synchrotron radiation
SEM
The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering
会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:
Liu, Jiahui
;
Ma, Haitao
;
Li, Shuang
;
Sun, Junhao
;
Kunwar, Anil
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/09
laser soldering
rapidly-solidified Sn3.5Ag0.7Cu
IMCs
Aging
The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows
会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:
Li, Shuang
;
Du, Yao
;
Qu, Lin
;
Kunwar, Anil
;
Sun, Junhao
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/09
intermetallic compounds (IMC)
morphology
growth behavior
Cu6Sn5
solidification
multiple reflows
A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder
会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:
Kunwar, Anil
;
Ma, Haitao
;
Sun, Junhao
;
Qu, Lin
;
Li, Shuang
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/09
Reliabilty
Single Bubble
Finite Element Method
Lagrangian Mesh Update
Axisymmetry
Diffusion Limited Region
Synchrotron Radiation
SEM
Interface
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