| A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder | |
| Kunwar, Anil; Ma, Haitao; Sun, Junhao; Qu, Lin; Li, Shuang; Liu, Jiahui | |
| 2014 | |
| 会议名称 | 15th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议日期 | 2014-08-12 |
| 会议地点 | Chinese Inst Elect, Chengdu, PEOPLES R CHINA |
| 关键词 | Reliabilty Single Bubble Finite Element Method Lagrangian Mesh Update Axisymmetry Diffusion Limited Region Synchrotron Radiation SEM Interface |
| 页码 | 602-605 |
| 会议录 | 15th International Conference on Electronic Packaging Technology (ICEPT)
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4428328 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Kunwar, Anil,Ma, Haitao,Sun, Junhao,et al. A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder[C]. 见:15th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Chengdu, PEOPLES R CHINA. 2014-08-12. |
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