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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Mesenchymal stem cell-loaded porous tantalum integrated with biomimetic 3D collagen-based scaffold to repair large osteochondral defects in goats 期刊论文 STEM CELL RESEARCH & THERAPY, 2019, 卷号: 10, 页码: 72 作者:  Wei, Xiaowei;  Liu, Baoyi;  Liu, Ge;  Yang, Fan;  Cao, Fang 收藏  |  浏览/下载：47/0  |  提交时间：2019/12/02 Osteochondral defect  Porous tantalum  Bone marrow mesenchymal stem cells  3D collagen-based scaffold  Tissue engineering  Osteochondral regeneration   A Novel Synthetic Dihydroindeno[1,2-b] Indole Derivative (LS-2-3j) Reverses ABCB1-and ABCG2-Mediated Multidrug Resistance in Cancer Cells 期刊论文 MOLECULES, 2018, 卷号: 23 作者:  Guo, Chao;  Liu, Fangyuan 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 indole derivative  multidrug resistance  K562/A02 cell line  MCF-7/ABCG2 cell line  ABCB1  ABCG2   Modeling the Diffusion-Driven Growth of a Pre-Existing Gas Bubble in Molten Tin 期刊论文 METALS AND MATERIALS INTERNATIONAL, 2015, 卷号: 21, 页码: 962-970 作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Li, Shuang;  Liu, Jiahui 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/09 bubble  metals  soldering  diffusion  synchrotron radiation   Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11 作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 IMC  morphology  cooling  temperature  synchrotron radiation   In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 bubbles  intermetallic compound  Interfacial reaction  Diffusion  Dissolution  Synchrotron radiation  SEM   The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Liu, Jiahui;  Ma, Haitao;  Li, Shuang;  Sun, Junhao;  Kunwar, Anil 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 laser soldering  rapidly-solidified Sn3.5Ag0.7Cu  IMCs  Aging   The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 intermetallic compounds (IMC)  morphology  growth behavior  Cu6Sn5  solidification  multiple reflows   A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 Reliabilty  Single Bubble  Finite Element Method  Lagrangian Mesh Update  Axisymmetry  Diffusion Limited Region  Synchrotron Radiation  SEM  Interface   The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction 会议论文 14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11 作者:  An, Lili;  Ma, Haitao;  Qu, Lin;  Wang, Jie;  Liu, Jiahui 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11 lead-free solder  laser-soldering  IMC  interfacial reaction