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CVm6A: A Visualization and Exploration Database for m(6)As in Cell Lines 其他
2019-01-01
作者:  Han, Yujing;  Feng, Jing;  Xia, Linjian;  Dong, Xin;  Zhang, Xinyang
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05
Impact of neutralizing antibodies against AAV is a key consideration in gene transfer to nonhuman primates Reply 其他
2018-01-01
作者:  Wang, Pi-Xiao;  Zhao, Guang-Nian;  Ji, Yan-Xiao;  Zhang, Peng;  Zhang, Xiao-Jing
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05
Impact of neutralizing antibodies against AAV is a key consideration in gene transfer to nonhuman primates Reply 其他
2018-01-01
作者:  Wang, Pi-Xiao;  Zhao, Guang-Nian;  Ji, Yan-Xiao;  Zhang, Peng;  Zhang, Xiao-Jing
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/05
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他
2016-01-01
Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Childhood sexual abuse and the development of recurrent major depression in Chinese women 其他
2015-01-01
作者:  Chen, Jing;  Cai, Yiyun;  Cong, Enzhao;  Liu, Ying;  Gao, Jingfang
收藏  |  浏览/下载：17/0  |  提交时间：2019/12/02
Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他
2013-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16
Investigations of Silicon Wafer Bonding Using Thin Al and Sn Films for Heterogeneous Integration 其他
2013-01-01
Zhu, Zhiyuan; Wang, Shaonan; Xu, Yichao; Wang, Guanjiang; Pi, Yudan; Wang, Peiquan; Zhu, Yunhui; Sun, Xin; Yu, Min; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13

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