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华南理工大学 [34]
内容类型
会议 [34]
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Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
microvoids
solder interconnect
electrical field
phase field simulation
Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Liang, Shui-bao[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/11
Kirkendall void
growth exponent
morphological evolution
cyclic loading
phase field cystal model
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录)
会议
作者:
Yue, Wu[1]
;
Zhou, Min-Bo[2,3]
;
Zhang, Xin-Ping[2,3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
laser jet solder ball bonding
Sn-3.0Ag-0.5Cu solder ball
wettability
surface contamination
Highly stable and efficient platinum nanoparticles supported on TiO2@Ru-C: investigations on the promoting effects of the interpenetrated TiO (CPCI-S收录)
会议
作者:
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/11
TiO2@Ru
stability
electrocatalysts
utilization efficiency
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Ma, Wen-Jing[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
segregation
electromigration
Sn-Bi solder
interconnect
phase field simulation
Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature (CPCI-S收录)
会议
作者:
Jin, Hong
;
Zhu, Jie-Fei
;
Zhou, Min-Bo
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
Ag-plated Cu flakes
plating process
hybrid paste
sintered joints
Sneak-path Based Test for 3D Stacked One-Transistor-N-RRAM Array (CPCI-S收录)
会议
作者:
Zhang, Qiang[1]
;
Cui, Xiaole[1]
;
Xu, Xiaoyan[1]
;
Wang, Xin'an[1]
;
Ma, Zhi[2]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
RRAM
test technique
sneak-paths
resistance variation
Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
Phase field crystal model
Microstructure evolution
Microcrack propagation
Strain
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