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科研机构
上海大学 [41]
复旦大学上海医学院 [1]
武汉理工大学 [1]
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会议论文 [43]
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An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Chen, Shujing[1]
;
Shan, Bo[2]
;
Yang, Yiqun[3]
;
Yuan, Guangjie[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Interconnect
CNTs based bumps
CNTs basednTSVs
resistivity
CNTs-Cu nanocomposite
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Huang, Shirong[1]
;
Ke, Wei[2]
;
Yang, Yiqun[3]
;
Ye, Hui[4]
;
Chen, Shujing[5]
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2019/04/24
Graphene protection barrier
Cu-Plated PCB
Reliability
Graphene-CNT Hybrid Material as Potential Thermal Solution in Electronics Applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Darmawan, Christian Chandra[1]
;
Ye, Lilei[2]
;
Samani, Majid Kabiri[3]
;
Fu, Yifeng[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/24
Graphene
CNT
Covalent bonding
Thermal Management
Thermal Conductivity
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Nylander, Andreas[1]
;
Fu, Yifeng[2]
;
Ye, Lilei[3]
;
Liu, Johan[4]
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/04/24
Thermal interface materials
thermal management
electronics cooling
carbon nanotube
functionalization
Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
会议论文
29th IEEE International Conference on Microelectronic Test Structures (ICMTS)
作者:
Jeppson, Kjell[1]
;
Bao, Jie[2]
;
Huang, Shirong[3]
;
Zhang, Yong[4]
;
Sun, Shuangxi[5]
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2019/04/26
test structure
resistance temperature detectors
hotspots
heat spreaders
graphene
boron nitride
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
会议论文
6th Electronic System-Integration Technology Conference (ESTC)
作者:
Fu, Yifeng[1]
;
Mu, Wei[2]
;
Sun, Shuangxi[3]
;
Wang, Ning[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2019/04/26
Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art
会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:
Zehri, Abdelhafid[1]
;
Hansson, Josef[2]
;
Ye, Lilei[3]
;
Fu, Yifeng[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/26
Carbon nanotube growth on different underlayers for thermal interface material application
会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:
Fu, Yifeng[1]
;
Sun, Shuangxi[2]
;
Mu, Wei[3]
;
Ye, Lilei[4]
;
Leveugle, Elodie[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/26
Heat dissipation of a hybrid CNT/Graphene based heat spreader
会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:
Sun, Shuangxi[1]
;
Su, Peng[2]
;
Wang, Nan[3]
;
Zhang, Yong[4]
;
Fu, Yifeng[5]
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2019/04/26
Graphene-based heater
会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:
Zhang, Yong[1]
;
Edwards, Michael[2]
;
Fu, Yifeng[3]
;
Liu, Johan[4]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/26
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