QQ客服 官方微博 反馈留言

	Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
	Nylander, Andreas[1]; Fu, Yifeng[2]; Ye, Lilei[3]; Liu, Johan[4]
	2017
会议名称	2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC)
会议日期	2017-01-01
关键词	Thermal interface materials thermal management electronics cooling carbon nanotube functionalization
页码	175-181
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2182376
专题	上海大学
作者单位	1.[1]Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 2.[2]Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 3.[3]SHT Smart High Tech AB, Aschebergsgatan 46, SE-41133 Gothenburg, Sweden. 4.[4]Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden. 5.Shanghai Univ, SMIT Ctr, Sch Mech Engn & Automat, Jiading Campus,20 Chengzhong Rd, Shanghai 201800, Peoples R China.
推荐引用方式 GB/T 7714	Nylander, Andreas[1],Fu, Yifeng[2],Ye, Lilei[3],et al. Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications[C]. 见:2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC). 2017-01-01.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。