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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 heat spreading materials  graphene-based film  graphene-based electrically conductive adhesive  electronics packaging   Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 heat dissipation  silver coated graphene  electrically conductive adhesive   Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders 会议论文 29th IEEE International Conference on Microelectronic Test Structures (ICMTS) 作者:  Jeppson, Kjell[1];  Bao, Jie[2];  Huang, Shirong[3];  Zhang, Yong[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：19/0  |  提交时间：2019/04/26 test structure  resistance temperature detectors  hotspots  heat spreaders  graphene  boron nitride   Finite element simulation of 2D-based materials as heat spreaders. 会议论文 IMAPS Nordic Annual Conference 2016, 2016-06-05 作者:  Edwards, Michael[1];  Zhang, Yong[2];  Bao, Jie[3];  Samani, Majid Kabiri[4];  Jeppson, Kjell[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders 会议论文 29th IEEE International Conference on Microelectronic Test Structures, ICMTS 2016, 2016-03-28 作者:  Jeppson, Kjell[1];  Bao, Jie[2];  Huang, Shirong[3];  Zhang, Yong[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging 会议论文 6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13 作者:  Huang, Shirong[1];  Wang, Ning[2];  Bao, Jie[3];  Ye, Hui[4];  Zhang, Dongsheng[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26 vertically aligned multiwall carbon nanotubes  electronic packaging  infrared emissivity characterization  homogeneous sparseness   The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Huang, Shirong[1];  Bao, Jie[2];  Ye, Hui[3];  Wang, Ning[4];  Yuan, Guangjie[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26 Graphene-based film  Thermal performance  Finite element analysis  Electronic packaging   Thermal properties of TIM using CNTs forest in electronics packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Zhang, Dongsheng[1];  Liu, Jiawen[2];  Sun, Shuangxi[3];  Huang, Shirong[4];  Bao, Jie[5] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/26 VACNT  heat  dissipation  hotspot  thermal test chip  resistance temperature detector