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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2014    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 bubbles  intermetallic compound  Interfacial reaction  Diffusion  Dissolution  Synchrotron radiation  SEM   The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Liu, Jiahui;  Ma, Haitao;  Li, Shuang;  Sun, Junhao;  Kunwar, Anil 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 laser soldering  rapidly-solidified Sn3.5Ag0.7Cu  IMCs  Aging   The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 intermetallic compounds (IMC)  morphology  growth behavior  Cu6Sn5  solidification  multiple reflows   A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 Reliabilty  Single Bubble  Finite Element Method  Lagrangian Mesh Update  Axisymmetry  Diffusion Limited Region  Synchrotron Radiation  SEM  Interface