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浏览/检索结果: 共128条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Formation mechanism of a cathodic serrated interface and voids under high current density 期刊论文 MATERIALS LETTERS, 2018, 卷号: 211, 页码: 191-194 作者:  Zhang, Z. H.[1,2];  Cao, H. J.[3];  Chen, H. T.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/22 Diffusion  Interfaces  Electromigration  Thermomigration  Solder  Intermetallic compound   Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (EI收录) 期刊论文 IEEE Transactions on Power Electronics, 2017, 卷号: 32, 页码: 1431-1441 作者:  Lai, Wei[1];  Chen, Minyou[1];  Ran, Li[2];  Xu, Shengyou[1];  Jiang, Nan[1] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/24 Insulated gate bipolar transistors (IGBT)  Outages  Reliability  Stress concentration   Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys   Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2solder joints (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2016, 卷号: 684, 页码: 299-309 作者:  Tang, Y.[1];  Luo, S.M.[1];  Wang, K.Q.[1];  Li, G.Y.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Activation energy  Chemical activation  Copper compounds  Diffusion  Energy dispersive spectroscopy  Grain boundaries  Grain growth  Intermetallics  Lead  free solders  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Titanium dioxide  X ray diffraction  X ray spectroscopy   Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing (EI收录SCI收录) 期刊论文 Transactions of Nonferrous Metals Society of China (English Edition), 2014, 卷号: 24, 页码: 1619-1628 作者:  Yue, Wu[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Electric resistance  Electromigration  Electron probe microanalysis  Finite element method  Plastic deformation   Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn-3.0Ag-0.5Cu-xTiO2 composite solder (EI收录SCI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2013, 卷号: 24, 页码: 1587-1594 作者:  Tang, Y.[1,2];  Pan, Y.C.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/25 Adsorption  Microstructure  Nanoparticles  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Thermodynamic properties  Titanium dioxide  Wetting  X ray diffraction analysis   Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2013, 卷号: 554, 页码: 195-203 作者:  Tang, Y.[1,2];  Li, G.Y.[1];  Pan, Y.C.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Adsorption  Curve fitting  Energy dispersive spectroscopy  Grain growth  Grain size and shape  Growth kinetics  Intermetallics  Kinetics  Nanoparticles  Ostwald ripening  Reaction kinetics  Scanning electron microscopy  Soldered joints  Soldering  Soldering alloys  Tin  Titanium dioxide  X ray diffraction analysis   Thermal fatigue and creep fracture behaviors of a nanocomposite solder in microelectronic/optoelectronic packaging (CPCI-S收录) 会议论文 FRACTURE OF MATERIALS: MOVING FORWARDS 作者:  Zhang, X. P.;  Lim, C. S. H.;  Mai, Y. W.;  Shi, Y. W. 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 thermal fatigue  creep resistance  nano-composite solder  tin-lead solder  fracture   Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling (CPCI-S收录) 会议论文 MICROELECTRONICS RELIABILITY 作者:  Chen, H. T.;  Wang, C. Q.;  Li, M. Y. 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures