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Reliability estimation model of IC's interconnect based on uniform distribution of defects on a chip (CPCI-S收录) 会议论文
18TH IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT TOLERANCE IN VLSI SYSTEMS, PROCEEDINGS
作者:  Zhao, TX;  Duan, XC
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/19
Reliability estimation model of IC's interconnect based on uniform distribution of defects on a chip (EI收录) 会议论文
Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, Boston, MA, United states, November 3, 2003 - November 5, 2003
作者:  Zhao, Tianxu[1,2];  Hao, Yue[1,2];  Ma, Peijun[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/19
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration (CPCI-S收录) 会议
作者:  Liu, Huan[1];  Zeng, Qinghua[1];  Guan, Yong[1];  Fang, Runiu[1];  Sun, Xin[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Characteristic recognition of IC chip's micro-topography defects based on image projection transformation and energy optimization modeling (EI收录) 会议论文
Advanced Materials Research, Guangzhou, China, December 7, 2010 - December 9, 2010
作者:  Liang, Zhongwei[1];  Zhang, Chunliang[1];  Wang, Yijun[1];  Xiao, Zhongmin[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/16
Design for improved NBTI reliability of CMOS digital IC (EI收录) 会议论文
2010 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2010, Hong Kong, China, December 15, 2010 - December 17, 2010
作者:  Liu, Lining[1];  Li, Bin[1];  Zhao, Mingjian[1];  Xie, Jiang[2]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/16


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