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	Reliability estimation model of IC's interconnect based on uniform distribution of defects on a chip (EI收录)
	Zhao, Tianxu[1,2]; Hao, Yue[1,2]; Ma, Peijun[2]
会议名称	Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems
会议日期	November 3, 2003 - November 5, 2003
会议地点	Boston, MA, United states
关键词	Defects Electromigration Fault tolerance Integrated circuits
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2140408
专题	华南理工大学
作者单位	1.[1] Department of Mathematics, Baoji College of Arts and Sciences, Baoji 2.721007, China 3.[2] Microelectronics Institute, Xidian University, Xi'an 4.710071, China
推荐引用方式 GB/T 7714	Zhao, Tianxu[1,2],Hao, Yue[1,2],Ma, Peijun[2]. Reliability estimation model of IC's interconnect based on uniform distribution of defects on a chip (EI收录)[C]. 见:Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems. Boston, MA, United states. November 3, 2003 - November 5, 2003.

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