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浏览/检索结果: 共52条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys   Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler (EI收录) 期刊论文 Materials Science and Engineering A, 2017, 卷号: 680, 页码: 317-323 作者:  Cheng, L.X.[1];  Liu, M.R.[2];  Wang, X.Q.[3];  Yan, B.H.[1];  Li, G.Y.[4] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Bonding  Cerium alloys  Chemical bonds  Fracture  Gallium  Gallium alloys  Interfaces (materials)  Intermetallics  Low temperature engineering  Microstructure  Silica  Silicon oxides  Soldering  Substrates  Temperature  Thermodynamics  Titanium   Trapped-charge-effect-based above-threshold current expressions for amorphous silicon tfts consistent with pao-sah model (EI收录SCI收录) 期刊论文 IEEE Transactions on Electron Devices, 2014, 卷号: 61, 页码: 3744-3750 作者:  He, Hongyu[1,2];  He, Jin[3];  Deng, Wanling[4];  Wang, Hao[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/25 Amorphous films  Silicon  Thin film transistors  Threshold voltage   Mechanical behavior of structured granite residual soil (EI收录) 期刊论文 Electronic Journal of Geotechnical Engineering, 2014, 卷号: 19 S, 页码: 4457-4464 作者:  Lingwei, Chen[1];  Xiaowen, Zhou[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Geotechnical engineering  Soil testing  Soils   Instability of indium zinc oxide thin-film transistors under transmission line pulsed stress (EI收录) 期刊论文 IEEE Electron Device Letters, 2014, 卷号: 35, 页码: 1254-1256 作者:  Liu, Yuan[1];  Wu, Wei-Jing[2];  Lei, Zhi-Feng[1];  Wang, Lei[2];  Shi, Qian[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/25 Electric grounding  Electric lines  Electrostatic devices  Electrostatic discharge  Indium  MOS devices  Semiconducting organic compounds  Single crystals  Spurious signal noise  Thin films  Threshold voltage  Transmission line theory  Zinc  Zinc oxide   Experimental analysis on the influence of organic matter under network distribution on time-effect deformation property (EI收录) 期刊论文 Electronic Journal of Geotechnical Engineering, 2013, 卷号: 18 V, 页码: 5563-5571 作者:  Yuan, Jie[1];  Fang, Yingguang[1];  Gu, Renguo[1];  Zhang, Fan[1];  Hu, Guixian[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/25 Biogeochemistry  Biological materials  Organic compounds  Quartz  Rheology  Soil testing  Viscosity   Developing real-time system based on model driven architecture (EI收录) 会议论文 2006 IEEE International Conference on Mechatronics and Automation, ICMA 2006, Luoyang, China, June 25, 2006 - June 28, 2006 作者:  Gao, Junli[1];  Li, Di[2];  Zheng, Shixiong[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 Computer architecture  Electronic equipment testing  Iterative methods  Machine design  Software prototyping  Verification   Analysis of PCB defects (CPCI-S收录) 会议论文 ICEMI 2005: CONFERENCE PROCEEDINGS OF THE SEVENTH INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS, VOL 8 作者:  Cao, ZN;  Luo, W;  Zhang, MY;  Song, GS 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/18 analysis  PCB board  defect   Analysis of error in measurement during destructive double bond pull test (EI收录) 会议论文 ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings, Shanghai, China, October 28, 2003 - October 30, 2003 作者:  Huang, Qiang[1];  Liu, Ying[1];  Guo, Daqi[1];  Ding, Rongzheng[1];  Zhang, Guohua[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/19 Bonding  Electronics packaging  Error analysis  Error correction  Force measurement  Hooks  Microelectronics  Packaging  Position measurement  Testing  Wire   Fabrication of SiC preform for SiC/Al composite in electronic packaging (EI收录) 会议论文 ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings, Shanghai, China, October 28, 2003 - October 30, 2003 作者:   收藏  |  浏览/下载：3/0  |  提交时间：2019/04/19 Electronics packaging  Fabrication  Particle size  Powders  Preforming  Rheology  Shear deformation  Shear thinning  Silicon carbide  Solids  Testing  Viscosity