CORC

在结果中检索

CORC

浏览/检索结果: 共39条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Interaction of lateral cracks in double scratching of single-crystal silicon carbide 期刊论文
Theoretical and Applied Fracture Mechanics, 2019, 卷号: 104
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Meng, Jianfeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/11
Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw 期刊论文
CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 1, 页码: 384-393
作者:  Wang, Peizhi;  Ge, Peiqi;  Ge, Mengran;  Bi, Wenbo;  Meng, Jianfeng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 100, 页码: 98-105
作者:  Ge, Mengran;  Zhu, Hongtao;  Ge, Peiqi;  Zhang, Cheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
New materials for semi-insulating sic single crystal growth by PVT method 会议论文
12th European Conference on Silicon Carbide and Related Materials, ECSCRM 2018, September 2, 2018 - September 6, 2018
作者:  Choi, Jeong-Min;  Lee, Chae-Young;  Kim, Dae-Sung;  Park, Mi-Seon;  Jang, Yeon-Suk
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/31
Structural strain in single layer graphene fabricated on SiC 会议论文
12th European Conference on Silicon Carbide and Related Materials, ECSCRM 2018, September 2, 2018 - September 6, 2018
作者:  Yu, Wancheng;  Chen, Xiufang;  Hu, Xiaobo;  Xu, Xiangang;  Jin, Peng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31
Experimental study of rectangular groove texture in the surface of photovoltaic silicon with diamond coated micro-milling tools 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 86, 页码: 23-35
作者:  Wu, Yuantai;  Zhang, Lei;  Ge, Peiqi;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 74, 页码: 261-266
作者:  Ge, Mengran;  Zhu, Hongtao;  Huang, Chuanzhen;  Liu, Ao;  Bi, Wenbo
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11
Stress analysis in scratching of anisotropic single-crystal silicon carbide 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 141, 页码: 1-8
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Liu, Tengyun;  Gao, Yufei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11
Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide 期刊论文
ENGINEERING FRACTURE MECHANICS, 2017, 卷号: 184, 页码: 273-285
作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Ge, Mengran;  Liu, Tengyun
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/12
Quantitative Analysis of the Micro Friction of Single Crystal Silicon 期刊论文
Materials Science Forum, 2016, 期号: 874, 页码: 375-380
作者:  Ru.Tian;  Hong Tao.Zhu;  Chuan Zhen.Huang;  Jun.Wang;  Ao.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/16

©版权所有 ©2017 CSpace - Powered by CSpace