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大连理工大学 [33]
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期刊论文 [21]
会议论文 [8]
专利 [4]
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2020 [1]
2019 [2]
2018 [7]
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专题:大连理工大学
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Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the application
期刊论文
Materials Chemistry and Physics, 2020, 卷号: 239
作者:
Zhao, Ming
;
Du, Liqun
;
Xu, Zheng
;
Zhang, Xi
;
Cao, Qiang
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  |  
浏览/下载:77/0
  |  
提交时间:2019/11/29
Fabrication of metal microfluidic chip mold with coplanar auxiliary cathode in the electroforming process
期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2019, 卷号: 29
作者:
Zhao, Ming
;
Du, Liqun
;
Wei, Zhuangzhuang
;
Du, Chengquan
;
Liu, Xuqiang
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/12/02
metal microfluidic chip mold
thickness uniformity of micro electroforming
coplanar auxiliary cathode
computer-aided analysis
Quantitative study of mass transfer in megasonic micro electroforming based on mass transfer coefficient: Simulation and experimental validation
期刊论文
ELECTROCHIMICA ACTA, 2019, 卷号: 297, 页码: 328-333
作者:
Zhao, Ming
;
Du, Liqun
;
Du, Chengquan
;
Wei, Zhuangzhuang
;
Ji, Xuechao
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/12/02
Mass transfer coefficient
Megasonic micro electroforming
Simulated method
Sonoelectrochemical experiment
Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation
期刊论文
ULTRASONICS SONOCHEMISTRY, 2018, 卷号: 48, 页码: 424-431
作者:
Zhao, Ming
;
Du, Liqun
;
Qi, Leijie
;
Li, Yuanqi
;
Li, Yu
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Microvias electroforming
Ultrasonic
Simulation
Electrochemical experiments
Micro-column array structures
Reducing the residual stress in micro electroforming layer by megasonic agitation
期刊论文
ULTRASONICS SONOCHEMISTRY, 2018, 卷号: 49, 页码: 233-240
作者:
Song, Chang
;
Du, Liqun
;
Ji, Xuechao
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  |  
浏览/下载:15/0
  |  
提交时间:2019/12/02
Megasonic agitation
Micro electroforming
Residual stress
Dislocation density
Acoustic cavitation
Crystal orientation
Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro electroforming process
期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2018, 卷号: 28
作者:
Du, Liqun
;
Zhao, Wenjun
;
Zhai, Ke
;
Song, Chang
;
Li, Qingfeng
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
micro electroforming
adhesion strength
through
mask electrochemical etching
pickling
microfluidic chip mold
Usage of Janus green B for the improvement of the filling effect during replication process of nanoimprint nickel stamp
期刊论文
MICRO & NANO LETTERS, 2018, 卷号: 13, 页码: 24-26
作者:
Zhang, Ran
;
Zheng, Yongguang
;
Liu, Ze
;
Chu, Jinkui
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/02
nickel
nanolithography
filling
electrodeposition
electroforming
seals (stoppers)
Janus green B
filling effect
replication process
nanoimprint nickel stamp
void elimination
JGB molecules
high aspect ratio nanotrenches
nanoelectroforming process
electron density
metal deposition rate
sealing phenomenon
electrodeposition process
depth 200 nm
size 80 nm
Ni
Effectiveness of stress release geometries on reducing residual stress in electroforming metal microstructure
期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2018, 卷号: 28
作者:
Song, Chang
;
Du, Liqun
;
Zhao, Wenjun
;
Zhu, Heqing
;
Zhao, Wen
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
metal microstructure
residual stress
stress release geometries
stress concentration
stress non-uniformity
Research of megasonic electroforming equipment based on the uniformity of electroforming process.
期刊论文
Ultrasonics sonochemistry, 2018, 卷号: 42, 页码: 368-375
作者:
Zhai Ke
;
Du Liqun
;
Wang Weitai
;
Zhu Heqing
;
Zhao Wenjun
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Acoustic radiation,Electroforming,Half wave resonance,Megasonic,Uniformity
Megasonic electroforming device for improving uniformity of metal electroforming, comprises shell, cathode plate, anode plate and display and power supply control box, which are electrically connected and fixed in shell.
专利
申请日期: 2018-01-01, 公开日期: 2018-05-11
作者:
DU L ZHAI K WANG W ZHU H ZHAO W
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
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