CORC

在结果中检索

CORC

浏览/检索结果: 共58条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Wafer-level fabrication of nanocone forests by plasma repolymerization technique for surface-enhanced Raman scattering devices 期刊论文
APPLIED SURFACE SCIENCE, 2017
Mao, Haiyang; Huang, Chengjun; Wu, Wengang; Xue, Mei; Yang, Yudong; Xiong, Jijun; Ming, Anjie; Wang, Weibing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
A wafer-level characterization method of ESD protection circuits for both component-level and system-level applications 其他
2016-01-01
Wang, Yuan; Lu, Guangyi; Zhang, Xing
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
High sensitivity and large measurement range refractometric sensing based on Mach-Zehnder interferometer 其他
2016-01-01
Zhang, G.; Cai, H.; Gu, Y.D.; Song, J.F.; Dong, B.; Yang, Z.C.; Jin, Y.F.; Hao, Y.L.; Sivalingam, S.P.; Yap, P.H.; Kwong, D.L.; Liu, A.Q.
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
HIGH SENSITIVITY AND LARGE MEASUREMENT RANGE REFRACTOMETRIC SENSING BASED ON MACH-ZEHNDER INTERFEROMETER 其他
2016-01-01
Zhang, G.; Cai, H.; Gu, Y. D.; Song, J. F.; Dong, B.; Yang, Z. C.; Jin, Y. F.; Hao, Y. L.; Sivalingam, S. P.; Yap, P. H.; Kwong, D. L.; Liu, A. Q.
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
A Wafer-level Characterization Method of ESD Protection Circuits for Both Component-level and System-level Applications 其他
2016-01-01
Wang, Yuan; Lu, Guangyi; Zhang, Xing
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
晶圆级LED驱动电路系统 期刊论文
太赫兹科学与电子信息学报, 2016
徐飞; 蔡勇; 时广轶; 张亦斌; 徐建伟
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04
Investigation of thermal characteristics and two-phase flows of a star-shape thin heat pipe 期刊论文
APPLIED THERMAL ENGINEERING, 2016
Wang, Zhenyu; Zhang, Ning; Jiao, Binbin; Yu, Xinhai
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03

©版权所有 ©2017 CSpace - Powered by CSpace