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CORC

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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02
Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru
收藏  |  浏览/下载：9/0  |  提交时间：2019/11/15
A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis 期刊论文
ANALYTICAL METHODS, 2019, 卷号: 11, 期号: 9, 页码: 1229-1236
作者:  Chang, Yongjia;  You, Hui
收藏  |  浏览/下载：5/0  |  提交时间：2020/07/14
Wideband horn antenna based on multi-substrate layer technology 期刊论文
ELECTRONICS LETTERS, 2019, 卷号: 55, 页码: 5-6
作者:  Yao, Xianxun;  Sun, Guolin
收藏  |  浏览/下载：17/0  |  提交时间：2019/12/30
Programming DNA origami patterning with non-canonical DNA-based metallization reactions 期刊论文
NATURE COMMUNICATIONS, 2019, 卷号: 10, 页码: -
作者:  Jia, SS;  Wang, JB;  Xie, M;  Sun, JX;  Liu, HJ
收藏  |  浏览/下载：22/0  |  提交时间：2020/10/16
A plug-in electrophoresis microchip with PCB electrodes for contactless conductivity detection 期刊论文
ROYAL SOCIETY OPEN SCIENCE, 2018, 卷号: 5, 期号: 5, 页码: 9
作者:  Yang, Mingpeng;  Huang, Zhe;  You, Hui
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/12
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05

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