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CORC

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Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Micromachined Cavity-based Bandpass Filter and Suspended Planar Slow-wave Structure for Vacuum-microelectronic Millimeter-wave/THz Microsystem Embedded in LTCC Packaging Substrates 其他
2015-01-01
Miao, Min; Fang, Runiu; Zhang, Xiaoqing; Ning, Biao; Mu, Fangqing; Li, Zhensong; Xiang, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
DESIGN  
Flexible fiber-type CdS quantum dot-sensitized solar cells containing multiple working electrodes 其他
2015-01-01
Huan Liu; Gengmin Zhang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
A framework for streaming service composition 其他
2014-01-01
Wan, Zhitao; Wang, Ping
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Design of mobile terminal multimedia communication system in intelligent community based on SIP 其他
2014-01-01
Huang, Lian Fen; Lin, Jin Feng; Huang, Zhi Chao; Chen, Qing Yue; Lin, He Zhi; 黄联芬; 林和志
收藏  |  浏览/下载：7/0  |  提交时间：2015/07/22
The design of E-Learning service model based on SIP protocol 其他
2014-01-01
Chen, Yiming; Tang, Yuliang; 唐余亮
收藏  |  浏览/下载：2/0  |  提交时间：2015/07/22
Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform 其他
2013-01-01
Miao, Min; Jin, Yufeng; Fang, Runiu; Mu, Fangqing; Guo, Shichao; Zhang, Xiaoqing; Zhang, Yang; Hu, Duwei; Li, Zhensong; Xiang, Wei
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/17
Design and implementation of a mobile intelligent district value-added service platform based on SIP and Web Service 其他
2013-01-01
Huang, Lian Fen; Huang, Shu Rong; Lin, He Zhi; Hu, Yi Bo; 黄联芬
收藏  |  浏览/下载：3/0  |  提交时间：2015/07/22
The fatigue failure analysis of 3D SiP with Through Silicon Via 其他
2011-01-01
Kang, Wenping; He, Yang; Zhu, Zhiyuan; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate 其他
2011-01-01
Gan, Hua; Jin, Yufeng; Miao, Min; Sun, Xin
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13

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