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	Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform
	Miao, Min ; Jin, Yufeng ; Fang, Runiu ; Mu, Fangqing ; Guo, Shichao ; Zhang, Xiaoqing ; Zhang, Yang ; Hu, Duwei ; Li, Zhensong ; Xiang, Wei
	2013
英文摘要	Micromachining of three dimensional (3D) micro functional structures or modules in interposers/substrates has been demonstrated as a prospective solution to high-density and heterogeneous 3D integration on package level. As follow-ups of the author's research jobs reported on the 62nd ECTC, which have initially revealed the capability of a unified LTCC packaging and laminate micromachining platform as such a solution, 3 types of LTCC micro functional modules based on the platform are investigated further, with their designing, fabrication, samples and validation/test results presented in this paper. The samples are prepared with 10??25 layers of green tapes by micromachining perforated 2.5D features into the individual layers, filling them with sacrificial materials, and laminating/sintering to form micron to millimeter scale 3D micro-structures. Sometimes, laser machining is used to finalize the 3D microstructure. The modules include: a) piezoresistive micro-accelerometer integrated with a preamplifier and passives, which responds linearly to ??4g (gravity acceleration) acceleration input, with a nonlinearity -4 g; b) 3D cooling microchannels, with a rectangle cross section (of 200??m height) and a length over 20mm, which can cut the peak temperature by over 100K at a heat flux of 3.2W/cm2 dissipated by thick film resistors emulating IC heating; additionally, an off-the-shell LED module is used as a practical vehicle to demonstrate the significance and efficiency of these channels by comparing their cooling effect with that of a bulky fan-cooling module as demanded by the LED supplier; c) RF MEMS passive and active functional structure for sub-millimeter and THz applications, including a filter sample with mid-band frequency at 82GHz and 5GHz pass bandwidth, and a method to enhance the radiation bandwidth of 60GHz patch antenna by shaping the laminates into staircase and forming cavity coupling, both of which are validated with finite element full-wave analysis. ? 2013 IEEE.; EI; 0
语种	英语
DOI标识	10.1109/ECTC.2013.6575823
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/410730]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Miao, Min,Jin, Yufeng,Fang, Runiu,et al. Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform. 2013-01-01.

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