CORC

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CORC

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Local chemical ordering within the incubation period as a trigger for nanocrystallization of a highly supercooled Ti-based liquid 期刊论文
MATERIALS & DESIGN, 2018, 卷号: 156, 页码: 504-513
作者:  Wang, Z;  Chen, CL;  Ketov, SV;  Akagi, K;  Tsarkov, AA
收藏  |  浏览/下载：28/0  |  提交时间：2018/12/25
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing 期刊论文
CORROSION SCIENCE, 2018, 卷号: 139, 页码: 383-394
作者:  Wang, J;  Chen, G;  Sun, FL;  Zhou, ZX;  Liu, ZQ
收藏  |  浏览/下载：17/0  |  提交时间：2018/12/25
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
On the abnormal fast diffusion of solute atoms in alpha-Ti: A first-principles investigation 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 156-166
作者:  Zhang, LJ;  Chen, ZY;  Hu, QM;  Yang, R;  Hu, QM (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：44/0  |  提交时间：2018/06/05
The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M
收藏  |  浏览/下载：18/0  |  提交时间：2018/06/05
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ
收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Wettability of molten Sn on AlCoCrCuxFeNi high-entropy alloy 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 199, 页码: 1-6
作者:  Ma, G. F.;  Ye, H.;  Zhang, H. L.;  He, C. L.;  Zhang, H. F.
收藏  |  浏览/下载：14/0  |  提交时间：2018/01/10
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17

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