The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging

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	The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
	Tian, FF; Li, CF; Zhou, M; Liu, ZQ; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2018-04-05
卷号	740 页码:500-509
关键词	Heterogeneous Binary-systems Chemical-compound Layers 2 Elementary Substances Eutectic Snin Solder Intermetallic Compounds Phase Identification Reaction-diffusion Growth-kinetics Joint Transformations
ISSN号	0925-8388
英文摘要	Intermetallic compounds (IMCs) with three different morphologies were formed through an interfacial reaction between In-48Sn solder and polycrystalline Cu substrate, which are chunk-type Cu(In,Sn)(2) and duplex structural Cu-2(In,Sn). Two types of phase transformations between Cu(In,Sn)(2) and Cu-2(In,Sn) IMCs occurred during low temperature aging (20 degrees C and 40 degrees C) and high temperature aging (60 degrees C, 80 degrees C and 100 degrees C), respectively. At lower aging temperature, the duplex structural coarse-grain and fine-grain Cu-2(In,Sn) transformed into Cu(In,Sn)(2), and a characteristic evolution model was provided. At a higher aging temperature, Cu(In,Sn)(2) transformed completely into Cu-2(In,Sn) within a very short time period. Based on the designed Cr-marker experiments, the growth kinetics of coarse-grain and fine-grain Cu-2(In,Sn) sublayers at higher aging temperatures were investigated. It was concluded that the growth mechanism of Cu-2(In,Sn) is temperature dependent, which is volume-diffusion-controlled at 60 degrees C-80 degrees C, whereas grain boundary diffusion becomes rate-controlling at 100 degrees C. Through an elaborate design of aging test at 80 degrees C and 20 degrees C alternately, the reversible transformation between Cu-2(In,Sn) and Cu(In,Sn)(2) was observed and characterised. (C) 2017 Elsevier B.V. All rights reserved.; Intermetallic compounds (IMCs) with three different morphologies were formed through an interfacial reaction between In-48Sn solder and polycrystalline Cu substrate, which are chunk-type Cu(In,Sn)(2) and duplex structural Cu-2(In,Sn). Two types of phase transformations between Cu(In,Sn)(2) and Cu-2(In,Sn) IMCs occurred during low temperature aging (20 degrees C and 40 degrees C) and high temperature aging (60 degrees C, 80 degrees C and 100 degrees C), respectively. At lower aging temperature, the duplex structural coarse-grain and fine-grain Cu-2(In,Sn) transformed into Cu(In,Sn)(2), and a characteristic evolution model was provided. At a higher aging temperature, Cu(In,Sn)(2) transformed completely into Cu-2(In,Sn) within a very short time period. Based on the designed Cr-marker experiments, the growth kinetics of coarse-grain and fine-grain Cu-2(In,Sn) sublayers at higher aging temperatures were investigated. It was concluded that the growth mechanism of Cu-2(In,Sn) is temperature dependent, which is volume-diffusion-controlled at 60 degrees C-80 degrees C, whereas grain boundary diffusion becomes rate-controlling at 100 degrees C. Through an elaborate design of aging test at 80 degrees C and 20 degrees C alternately, the reversible transformation between Cu-2(In,Sn) and Cu(In,Sn)(2) was observed and characterised. (C) 2017 Elsevier B.V. All rights reserved.
学科主题	Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
语种	英语
资助机构	National Key R&D Program of China [2017YFB0305700]; Innovation Fund Project of IMR, CAS [2015-ZD02]; Osaka University Visiting Scholar Program [J135104902]
公开日期	2018-06-05
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/79374]
专题	金属研究所_中国科学院金属研究所
通讯作者	Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
推荐引用方式 GB/T 7714	Tian, FF,Li, CF,Zhou, M,et al. The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2018,740:500-509.
APA	Tian, FF,Li, CF,Zhou, M,Liu, ZQ,&Liu, ZQ .(2018).The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging.JOURNAL OF ALLOYS AND COMPOUNDS,740,500-509.
MLA	Tian, FF,et al."The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging".JOURNAL OF ALLOYS AND COMPOUNDS 740(2018):500-509.