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浏览/检索结果: 共21条，第1-10条 帮助 限定条件 发表日期：2020    内容类型：期刊论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A nanotwin-based analytical model to predict dynamics in cryogenic orthogonal machining copper 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2020, 卷号: 111, 期号: 11-12, 页码: 3189-3205 作者:  Liu Y(刘垚);  Cai SL(蔡松林);  Chen Y(陈艳);  Su MY(苏明耀);  Dai LH(戴兰宏) 收藏  |  浏览/下载：148/0  |  提交时间：2020/12/28 Machining  METAL-CUTTING PROCESS  Orthogonal cutting model  SURFACE INTEGRITY  Cryogenic cooling  FLOW-STRESS  Hopf bifurcation  RATE SENSITIVITY  Nanotwin  INCONEL 718  GRAIN-SIZE  STRENGTH  MICROSTRUCTURE  DEFORMATION  SPEED   Evolution of Microstructure and Properties of SLM Formed Inconel 738 Alloy During Stress Relief Annealing 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4311-4320 作者:  Ding, Yutian;  Wang, Hao;  Xu, Jiayu;  Hu, Yong;  Zhang, Dong 收藏  |  浏览/下载：20/0  |  提交时间：2022/02/17 Annealing  Carbides  Grain boundaries  Melting  Microhardness  Microstructural evolution  Precipitation (chemical)  Residual stresses  Selective laser melting  Tensile strength  Annealing temperatures  Grain boundary carbides  Melting and solidification  Micro-structure evolutions  Microstructure and properties  Precipitation behavior  Selective laser melting (SLM)  Stress relief annealing   Simultaneously strengthening and toughening a core-shell structured particulate reinforced aluminum alloy-based composite by solid solution treatment 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 842 作者:  Zhang, J.Y.;  Chen, T.J.;  Zhang, X.Z.;  Gao, M.;  Geng, L.B. 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Aluminum alloys  Ductility  Eutectics  High strength alloys  Metallic matrix composites  Particles (particulate matter)  Reinforcement  Shells (structures)  Strengthening (metal)  Tensile strength  Yield stress  Micro-structure evolutions  Modified shear lag model  Particulate-reinforced metal matrix  Solid solution treatment  Strength and ductilities  Strength and elongations  Strengthening mechanisms  Ultimate tensile strength   Mechanical and High-Temperature Tribological Properties of Cr3C2-NiCr/TiN Duplex Coating 期刊论文 Journal of Materials Engineering and Performance, 2020, 卷号: 29, 期号: 无, 页码: 7207-7220 作者:  Lunlin Shang, Wensheng Li, Dongqing He, Pengjun Tang, Guangan Zhang, Zhibin Lu 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/19 duplex coating  high temperature  mechanical properties  tribological properties   High-Speed Impact Behavior and Microstructure Evolution of an Extruded Mg-7Sn-5Zn-3Al Alloy 期刊论文 Journal of Materials Engineering and Performance, 2020, 卷号: 29, 期号: 10, 页码: 6427-6438 作者:  Bi, Guangli;  Xu, Zuocheng;  Jiang, Jing;  Li, Yuandong;  Chen, Tijun 收藏  |  浏览/下载：19/0  |  提交时间：2020/12/18 Aluminum alloys  Dynamic recrystallization  Dynamics  Grain refinement  Grain size and shape  Magnesium alloys  Textures  Tin alloys  Zinc alloysAverage grain size  Dynamic recrystallization (DRX)  Elongation to failure  High strain rates  Micro-structure evolutions  Quasi cleavage fracture  Split Hopkinson pressure bars  Strain rate sensitivity   Hot deformation behavior and microstructure evolution of 6063 aluminum alloy modified by rare earth Y and Al-Ti-B master alloy 期刊论文 Materials, 2020, 卷号: 13, 期号: 19 作者:  Ding, Wanwu;  Liu, Xiaoxiong;  Zhao, Xiaoyan;  Chen, Taili;  Zhang, Haixia 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Binary alloys  Deformation  Dynamic recrystallization  Grain boundaries  Iron alloys  Microstructure  Rare earths  Silicon alloys  Strain rate  Titanium alloys  Compression experiments  Continuous dynamic recrystallization  Deformation temperatures  Deformed microstructure  Geometric dynamic recrystallization  Hot deformation behaviors  Micro-structure evolutions  True stress  true strain curves   Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：21/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion  Electric resistance  Electrodes  Growth rate  IV-VI semiconductors  Microstructure  Scanning electron microscopy  Tin  Tin compounds  Transmission electron microscopy  Diffusion process  Electrical resistances  Micro-structure evolutions  Porous structures  Thermodynamically stable  Thermoelectric  Volume diffusion  X ray diffractometers   Effect of Semi-Solid Isothermal Heat Treatment on Non-dendritic Structure of Mg-7Zn-1Cu-0.3V Magnesium Alloy 期刊论文 Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 14, 页码: 14116-14121 作者:  Huang, Xiaofeng;  Wei, Langlang;  Yang, Jianqiao;  Zhang, Qiaoqiao;  Shang, Wentao 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Coarsening  Copper alloys  Heat treatment  Isotherms  Ostwald ripening  Vanadium alloys  Zinc alloys  Dendritic particles  Dendritic structures  Holding temperatures  Isothermal heat treatments  Micro-structure evolutions  Non-dendritic microstructure  Non-dendritic structure  Ostwald ripening mechanism   Phase evolution and properties of (VNbTaMoW)C high entropy carbide prepared by reaction synthesis 期刊论文 Journal of the European Ceramic Society, 2020, 卷号: 40, 期号: 8, 页码: 2746-2751 作者:  Liu, Diqiang;  Zhang, Aijun;  Jia, Jiangang;  Meng, Junhu;  Su, Bo 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Entropy  Microstructure  Point defects  Sintered carbides  Sintering  Thermal conductivity  X ray diffraction  Graphite powder  Lattice distortions  Low thermal conductivity  Phase evolutions  Phase formations  Reaction synthesis  Single phase  XRD peaks   Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Diffusion  Growth rate  Soldering  Atomic diffusions  Compound layer  Diffusion channels  Diffusion process  Micro-structure evolutions  Plating thickness  Solder joint reliability  Solder joints