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CORC

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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：131/0  |  提交时间：2021/02/02
Constructing dual interfacial modification by synergetic electronic and ionic conductors: Toward high-performance LAGP-Based Li-S batteries 期刊论文
ENERGY STORAGE MATERIALS, 2019, 卷号: 23, 页码: 299
作者:  Li, Wenwen;  Wang, Qing;  Jin, Jun;  Li, Yanpei;  Wu, Meifen
收藏  |  浏览/下载：88/0  |  提交时间：2019/12/31
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Effects of Dissimilar Alumina Particulates on Microstructure and Properties of Cold-Sprayed Alumina/A380 Composite Coatings 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1449-1458
作者:  Qiu, Xiang;  Tariq, Naeem ul Haq;  Qi, Lu;  Tang, Jun-Rong;  Cui, Xin-Yu
收藏  |  浏览/下载：37/0  |  提交时间：2021/02/02
An investigation on particle weakening in T6-treated SiC/Al-Zn-Mg-Cu composites 期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 158, 页码: 10
作者:  Ma, G. N.;  Wang, D.;  Liu, Z. Y.;  Xiao, B. L.;  Ma, Z. Y.
收藏  |  浏览/下载：137/0  |  提交时间：2021/02/02
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Effect of nano-CeO2 addition on the consolidation of W-5Ni-3Cu alloy by a two-step sintering process 期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 15
作者:  Dong, Hongfeng;  Gong, Jun;  Li, Wensheng
收藏  |  浏览/下载：19/0  |  提交时间：2022/03/01
界面胶体体系聚集机制及剪切形变的微观结构研究 学位论文
北京: 中国科学院大学, 2019
作者:  谢天
收藏  |  浏览/下载：95/0  |  提交时间：2019/12/04
Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 810, 页码: 7
作者:  Sun, Hong;  Guo, Lijiang;  Deng, Nan;  Li, Xiaoyu;  Li, Jiangtao
收藏  |  浏览/下载：90/0  |  提交时间：2019/11/12
First-Principles Investigation of Thermodynamic Decomposition of Interfacial Oxides in Hot Compression Bonding 期刊论文
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2019, 卷号: 51, 期号: 2, 页码: 13
作者:  Zhang, Honglin;  Chen, Xing-Qiu;  Xu, Bin;  Sun, Mingyue;  Li, Dianzhong
收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02

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