Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders

doi:10.1016/j.jallcom.2019.151907

	Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders
	Sun, Hong 1,4; Guo, Lijiang 4; Deng, Nan 2,4; Li, Xiaoyu 4; Li, Jiangtao 3; He, Gang 3; Li, Jianqiang 1,4
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2019-11-25
卷号	810 页码:7
关键词	Metal matrix composites Electroplating Sintering Thermal conductivity
ISSN号	0925-8388
DOI	10.1016/j.jallcom.2019.151907
英文摘要	Actuated by the needs of high power electronic devices heat dissipation, diamond/Cu composites with excellent thermal dissipation properties have been considered as the next generation of thermal management material. Herein, an easy-to-operate intermittently electroplated method is developed for coating micro-sized particles and successfully applied to prepare Cu-coated diamond powders for the first time. The Cu coating is covered evenly and densely on the diamond particles surface, and its volume fraction in diamond/Cu composite powders could be precisely controlled by adjusting the plating time. The dense diamond/Cu composites bulks with varied Cu volume fractions were obtained by hot-press sintering process. The as-sintered microstructures of diamond/Cu bulks present that diamond particles are bonded strongly by Cu shell layer, which is conducive to promoting densification capacity. The maximal diamond/Cu composite bulk possesses high thermal conductivity of 638 W/(m.K) and low coefficient of thermal expansion (CTE) of 4.11 x 10(-6)/K at 55 vol% diamond. The bending strength of 45 vol% diamond/Cu composite reaches 276 MPa. The combination of these excellent thermal and mechanical properties, coupled with the simple, efficient powder-preparation process, demonstrate the large potential of intermittently electroplated method applying in the development of thermal management material. (C) 2019 Elsevier B.V. All rights reserved.
资助项目	Strategic Priority Research Program of the Chinese Academy of Sciences[XDA15013500] ; National Natural Science Foundation of China[51501179]
WOS关键词	METAL-MATRIX COMPOSITES ; COPPER/DIAMOND COMPOSITES ; CU/DIAMOND COMPOSITES ; INTERFACIAL DESIGN ; LAYER ; INFILTRATION ; OPTIMIZATION ; MANAGEMENT ; MICROSTRUCTURE ; PRETREATMENT
WOS研究方向	Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	ELSEVIER SCIENCE SA
WOS记录号	WOS:000486596000071
资助机构	Strategic Priority Research Program of the Chinese Academy of Sciences ; National Natural Science Foundation of China
内容类型	期刊论文
源URL	[http://ir.ipe.ac.cn/handle/122111/31013]
专题	中国科学院过程工程研究所
通讯作者	Li, Jianqiang
作者单位	1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China 2.Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China 3.Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100190, Peoples R China 4.Chinese Acad Sci, Inst Proc Engn, CAS Key Lab Green Proc & Engn, Natl Engn Lab Hydromet Cleaner Prod Technol, Beijing 100190, Peoples R China
推荐引用方式 GB/T 7714	Sun, Hong,Guo, Lijiang,Deng, Nan,et al. Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2019,810:7.
APA	Sun, Hong.,Guo, Lijiang.,Deng, Nan.,Li, Xiaoyu.,Li, Jiangtao.,...&Li, Jianqiang.(2019).Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders.JOURNAL OF ALLOYS AND COMPOUNDS,810,7.
MLA	Sun, Hong,et al."Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders".JOURNAL OF ALLOYS AND COMPOUNDS 810(2019):7.