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The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文
MATERIALS LETTERS, 2019, 卷号: 256
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载:14/0  |  提交时间:2019/11/15
Effect of twin boundaries on the microstructure and mechanical properties of Inconel 625 alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 767
作者:  Gao, Yubi;  Ding, Yutian;  Chen, Jianjun;  Xu, Jiayu;  Ma, Yuanjun
收藏  |  浏览/下载:0/0  |  提交时间:2020/02/24
Texture Evolution and Dislocation Behavior in a Nickel-Based Superalloy during Hot Compression 期刊论文
ADVANCED ENGINEERING MATERIALS, 2019, 卷号: 22, 期号: 3
作者:  Gao, Zexi;  Jia, Zhi;  Ji, Jinjin;  Liu, Dexue;  Guo, Tingbiao
收藏  |  浏览/下载:8/0  |  提交时间:2020/06/02
Evolution of Twin Boundaries and Contribution to Dynamic Recrystallization and Grain Growth of Inconel 625 期刊论文
ADVANCED ENGINEERING MATERIALS, 2019, 卷号: 21, 期号: 9
作者:  Jia, Zhi;  Gao, Zexi;  Ji, Jinjin;  Liu, Dexue;  Guo, Tingbiao
收藏  |  浏览/下载:8/0  |  提交时间:2019/11/15
Microstructures Characterization of Micro/Nanocrystalline Electrolytic Nickel Plates by Cold Rolling Deformation 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 6, 页码: 1975-1981
作者:  Xia Tiandong;  Guo Longbang;  Zhang Han;  Qiao Jisen
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/15
Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru
收藏  |  浏览/下载:1/0  |  提交时间:2020/11/14
Microstructure Stability of GH3625 Alloy During Over-temperature Service 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 5, 页码: 1605-1614
作者:  Ding Yutian;  Meng Bin;  Gao Yubi;  Ma Yuanjun;  Xu Jiayu
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/15
Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru
收藏  |  浏览/下载:7/0  |  提交时间:2019/11/15
Deformation and fracture mechanisms of gradient nanograined pure Ti produced by a surface rolling treatment 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 754, 页码: 121-128
作者:  Wang, Qi;  Ren, Junqiang;  Wang, Yinling;  Xin, Chao;  Xiao, Lin
收藏  |  浏览/下载:5/0  |  提交时间:2019/11/15
Deformation and fracture mechanisms of gradient nanograined pure Ti produced by a surface rolling treatment 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 754, 页码: 121-128
作者:  Wang, Qi;  Ren, Junqiang;  Wang, Yinling;  Xin, Chao;  Xiao, Lin
收藏  |  浏览/下载:5/0  |  提交时间:2022/03/01


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