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科研机构

兰州理工大学 [11]

北京航空航天大学 [5]

大连理工大学 [3]

过程工程研究所 [2]

上海大学 [2]

上海硅酸盐研究所 [2]

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期刊论文 [30]

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2019 [30]

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限定条件	发表日期：2019 内容类型：期刊论文

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	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/11/15 Ultrasonic-assisted soldering interfacial intermetallic compounds microstructure tin solder
	Li+ diffusion kinetics of SnS2 nanoflowers enhanced by reduced graphene oxides with excellent electrochemical performance as anode material for lithium-ion batteries 期刊论文 Journal of Alloys and Compounds, 2019, 卷号: 794, 页码: 285-293 作者: Liu, Jifei; Qi, Yufeng; Fu, Bi; Dai, Jianfeng; Wang, Qing 收藏 \| 浏览/下载：12/0 \| 提交时间：2020/11/14 Additives Anodes Diffusion Electric conductivity Electrochemical impedance spectroscopy Electrochemistry Energy storage Graphene Ionic conduction Ions IV-VI semiconductors Kinetics Lithium-ion batteries Nanocomposites Nanoflowers Reduced Graphene Oxide Semiconducting tin compounds Storage (materials) Anode material for lithium ion batteries Diffusion kinetics Electrochemical energy storage Electrochemical performance Energy storage and conversions Galvanostatic Intermittent Titration Techniques Reduced graphene oxides (RGO) Reversible specific capacity
	Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668 作者: Sui, Ran; Li, Fuxiang; Ci, Wenjuan; Lin, Qiaoli 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Bismuth alloys Copper Copper oxides Joining Oxide films Phase interfaces Soldering Ternary alloys Tin compounds Wetting Cu intermetallics IMC layer Interfacial reactivity Interfacial structures Sessile drop method Sn-Bi alloy Spreading characteristics Ternary phase diagrams
	Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者: Wang, Haozhong; Hu, Xiaowu; Li, Qinglin; Qu, Min 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/11/15 Binary alloys Coarsening Copper Growth rate Morphology Nanoparticles Rate constants Soldered joints Tin alloys Aging time Cu substrate IMC layer Inhibition effect Isothermal aging Lead-free solder joint Nanoparticle (NPs) Solder joints
	Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin; Zhou, Liuru 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Binary alloys Geometry Intermetallics Lead-free solders Morphology Polychlorinated biphenyls Silver compounds Soldered joints Tin alloys Aging time Compressive strain Enhanced effects Growth of intermetallics Kirkendall void Mean diameter Polyhedron shapes Solder joints
	Localized surface plasmon resonance induced excellent solar-shielding ability for TiN nanoparticles-based hybrid polymer optical foils with high transparency 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 782, 页码: 1087 作者: Zhou, Yijie; Huang, Aibing; Luo, Hongjie; Jin, Ping 收藏 \| 浏览/下载：53/0 \| 提交时间：2019/12/26 Titanium nitride Localized surface plasmon resonance Organic-inorganic composites Multifunctional transparent films
	Ammonia sensing properties of two-dimensional tin disulphide/tin oxides (SnS2/SnO2-x) mixed phases 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 781, 页码: 440 作者: Leonardi, Salvatore Gianluca; Wlodarski, Wojtek; Li, Yongxiang; Donato, Nicola; Bonavita, Anna 收藏 \| 浏览/下载：42/0 \| 提交时间：2019/12/26 2D-SnS2 flakes Heterostructure Gas sensor Ammonia NH3
	Research progress in lead-less or lead-free three-dimensional perovskite absorber materials for solar cells 期刊论文 International Journal of Minerals, Metallurgy and Materials, 2019, 卷号: 26, 期号: 4, 页码: 387-403 作者: Zhang, Huan-yu; Li, Rui; Liu, Wen-wu; Zhang, Mei; Guo, Min 收藏 \| 浏览/下载：0/0 \| 提交时间：2022/02/17 Cell engineering Convergence of numerical methods Deposition Efficiency Lead compounds Perovskite Solar absorbers Stability Tin compounds Transition metals Elemental compositions Interfacial modification Large-scale applications Lead-free perovskites Power conversion efficiencies Theoretical calculations Threedimensional (3-d) Transition metal elements

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