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CORC

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The Influence of A-quality Counterfeits on the Purchase Intention of Luxury Brands 会议论文
PROCEEDINGS OF 2018 CHINA MARKETING INTERNATIONAL CONFERENCE: SMART MARKETING: HUMAN, TECHNOLOGY AND INNOVATION, 2018-01-01
作者:  Shan, Juan[1];  Cui, Chenhong[2];  Zhang, Peng[3];  Wang, Yu[4];  Wang, Yaru[5]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/22
A Unified Reconfigurable Datapath for 5G Compatible LDPC Decoding 会议论文
2018 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS 2018), 2018-01-01
作者:  Lin, Ting[1];  Cao, Shan[2];  Zhang, Shunqing[3];  Xu, Shugong[4]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
A Fast Modular Inversion FPGA Implementation over GF(2(m)) using Modified x(2n) Unit 会议论文
2018 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2018-01-01
作者:  Li, Jiakun[1];  Li, Zhe[2];  Xue, Chengbo[3];  Zhang, Jingqi[4];  Gao, Wei[5]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/22
Dynamic transient analysis of friction noise in the trimmer blade system 会议论文
8th IEEE International Conference on Cybernetics and Intelligent Systems, CIS 2017 and IEEE Conference on Robotics, Automation and Mechatronics, RAM 2017, 2017-11-19
作者:  Zhang, Bo[1];  Chen, Xi-Liang[2];  Huang, Di-Shan[3];  Lin, Zhi-Li[4]
收藏  |  浏览/下载：12/0  |  提交时间：2019/04/22
A Fast Modular Inversion FPGA Implementation over GF(2m) using Modified x2n Unit 会议论文
IEEE International Symposium on Circuits and Systems, 2018-05-27
作者:  Jiakun Li[1];  Zhe Li[2];  Chengbo Xue[3];  Jingqi Zhang[4];  Wei Gao[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/22
The spectral radius and domination number of uniform hypergraphs 会议论文
11th International Conference on Combinatorial Optimization and Applications, COCOA 2017, 2017-12-16
作者:  Kang, Liying[1];  Zhang, Wei[2];  Shan, Erfang[3]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24
Dynamic transient analysis of friction noise in the trimmer blade system 会议论文
2017 IEEE INTERNATIONAL CONFERENCE ON CYBERNETICS AND INTELLIGENT SYSTEMS (CIS) AND IEEE CONFERENCE ON ROBOTICS, AUTOMATION AND MECHATRONICS (RAM), 2017-01-01
作者:  Zhang, Bo[1];  Chen, Xi-liang[2];  Huang, Di-shan[3];  Lin, Zhi-li[4]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24

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