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科研机构
兰州理工大学 [24]
西安理工大学 [3]
西安交通大学 [2]
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会议论文 [30]
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Investigation of effects of pattern structures arrangement on chemical mechanical polishing process
会议论文
Shanghai, China, March 11, 2018 - March 12, 2018
作者:
Wu, Lixiao
;
Hahn, Sookap
;
Yan, Changfeng
收藏
|
浏览/下载：1/0
|
提交时间：2020/11/15
Chemical mechanical polishing
Pressure distribution
Semiconductor device manufacture
Signal processing
Silicon wafers
Textile printing
Chemical-mechanical polishing process
Contact pressure distribution
Pattern arrangement
Pattern structure
Polishing processs
Splitting signals
Electromagnetic Design of a Megawatt High Efficiency High Speed Solid Rotor Induction Motor
会议论文
作者:
Zhang, Dongdong
;
An, Ruichi
;
He, Chengyuan
;
Bu, Lixiao
;
Wu, Thomas
收藏
|
浏览/下载：9/0
|
提交时间：2019/11/26
high-output
induction motor
solid rotor
high speed
A Modified 2-D Multislice FEM for Computing the Airgap Flux Density of Induction Motor with Skewed Slots
会议论文
作者:
Zhang, Dongdong
;
Bu, Lixiao
;
He, Chengyuan
;
An, Ruichi
;
Wu, Thomas
收藏
|
浏览/下载：6/0
|
提交时间：2019/11/26
2-D multi-slice FEM
skewed slot
airgap flux density
torque
induction motor
Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm
会议论文
Shanghai, China, March 13, 2016 - March 14, 2016
作者:
Wu, Lixiao
;
Hahn, Sookap
;
Yan, Changfeng
收藏
|
浏览/下载：2/0
|
提交时间：2020/11/15
Copper
Linear systems
Polishing
Semiconductor device manufacture
Silicon wafers
Textile printing
Copper CMP
Evolution process
Frequency components
Pattern density
Pattern structure
Polishing processs
Square waves
Wafer patterns
MODELING OF EVOLUTION PROCESS OF EDGE OVER EROSION IN COPPER CMP USING FREQUENCY COMPONENTS ALGORITHM
会议论文
作者:
Wu, Lixiao
;
Hahn, Sookap
;
Yan, Changfeng
收藏
|
浏览/下载：4/0
|
提交时间：2019/11/15
An analytical model of effects of 2-D pad surface textures on contact pressure distribution during CMP
会议论文
Shanghai, China, March 15, 2015 - March 16, 2015
作者:
Wu, Lixiao
;
Yan, Changfeng
收藏
|
浏览/下载：1/0
|
提交时间：2020/11/15
Numerical methods
Pressure distribution
Semiconductor device manufacture
Silicon wafers
Textures
Analytical results
Contact pressure distribution
Contact pressures
Numerical results
Pad asperities
Polishing processs
Simulation data
Surface textures
AN ANALYTICAL MODEL OF EFFECTS OF 2-D PAD SURFACE TEXTURES ON CONTACT PRESSURE DISTRIBUTION DURING CMP
会议论文
作者:
Wu, Lixiao
;
Yan, Changfeng
收藏
|
浏览/下载：16/0
|
提交时间：2019/11/15
Trend Feature Extraction in Condition Monitoring by a New Piecewise Linear Representation Method
会议论文
作者:
Yan, Changfeng
;
Yi, Cheng
;
Wu, Lixiao
;
Fang, Jianfang
收藏
|
浏览/下载：10/0
|
提交时间：2019/11/15
Trend Feature Extraction
Condition Monitoring
Piecewise Linear Representation
Local Maximum Minimum and Slope
Effects of polishing parameters on the evolution of wafer patterns during Cu CMP
会议论文
作者:
Wu, Lixiao
;
Yan, Changfeng
收藏
|
浏览/下载：1/0
|
提交时间：2020/11/15
Copper
Linear systems
Polishing
Chemical mechanical polishing(CMP)
IC industry
Linear system model
Pattern density
Polishing parameters
Selectivity ratio
Square waves
Wafer patterns
A Hybrid Method to Estimate Initial Faulty Time of Rolling Bearing
会议论文
作者:
Yan, Changfeng
;
You, Li
;
Kong, Yuanyuan
;
Wu, Lixiao
收藏
|
浏览/下载：12/0
|
提交时间：2019/11/15
Initial faulty time
rolling bearing
EMD
spectral kurtosis
energy
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