An analytical model of effects of 2-D pad surface textures on contact pressure distribution during CMP

doi:10.1109/CSTIC.2015.7153424

CORC > 兰州理工大学 > 兰州理工大学 > 机电工程学院

	An analytical model of effects of 2-D pad surface textures on contact pressure distribution during CMP
	Wu, Lixiao; Yan, Changfeng
	2015-07-08
会议日期	March 15, 2015 - March 16, 2015
会议地点	Shanghai, China
关键词	Numerical methods Pressure distribution Semiconductor device manufacture Silicon wafers Textures Analytical results Contact pressure distribution Contact pressures Numerical results Pad asperities Polishing processs Simulation data Surface textures
DOI	10.1109/CSTIC.2015.7153424
英文摘要	In order to model the effects of pad asperities on the polishing process, an analytical way to calculate the contact pressure between wafer and pad is given in this paper. The contact pressure based on a 2-D analytical model is compared with the numerical results which are obtained by finite element method (FEM). When the wafer surface contacts only several asperities of the pad textures and the distances between the asperities are small, the ignorance of the interaction of the contact asperities will bring differences between the analytical result and the numerical result. When the pad textures contact completely with wafer surface, the analytical result fit the simulation data very well. © 2015 IEEE.
会议录	China Semiconductor Technology International Conference 2015, CSTIC 2015
会议录出版者	Institute of Electrical and Electronics Engineers Inc.
语种	英语
内容类型	会议论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/117366]
专题	机电工程学院
作者单位	School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Wu, Lixiao,Yan, Changfeng. An analytical model of effects of 2-D pad surface textures on contact pressure distribution during CMP[C]. 见:. Shanghai, China. March 15, 2015 - March 16, 2015.