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浏览/检索结果: 共15条，第1-10条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他 2016-01-01 Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation  THROUGH-SILICON VIAS  STACKING TECHNOLOGY  LINER   Pleiotropic and puzzling effects of ATF3 in maladaptive cardiac remodeling 其他 2016-01-01 作者:  Zhou, Heng;  Yuan, Yuan;  Ni, Jian 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05 Activating transcription factor 3  Cardiac remodeling  Hypertrophy  Autophagy  Macrophages   Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他 2015-01-01 Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 INTERPOSER  STACKING   Electrical measurement and analysis of TSV/RDL for 3D integration 其他 2014-01-01 Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17 A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他 2014-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 INTERCONNECTS   ATF3 regulates multiple targets and may play a dual role in cardiac hypertrophy and injury 其他 2014-01-01 作者:  Zhou, Heng;  Guo, Haipeng;  Zong, Jing;  Dai, Jia;  Yuan, Yuan 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05 Activating transcription factor 3  Cardiac hypertrophy  Fibrosis  Inflammation   Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他 2013-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16 Chemical-Mechanical Polishing of Bulk Tungsten Substrate 其他 2013-01-01 Luo, Jin; Zhang, Yiming; Song, Lu; Chen, Shuhui; Bian, Yuan; Li, Tianyu; Hao, Yilong; Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 CMP  tungsten  average surface roughness  the platen rotational speed   GAMLL: Gateway Assisted Multicast Algorithm towards Low Latency for Wireless Mesh Networks 其他 2013-01-01 Yuan, Yuan; Bian, Chaoyi; Zhao, Tong; Yan, Wei 收藏  |  浏览/下载：7/0  |  提交时间：2015/11/16 ROUTING PROTOCOL   A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他 2012-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16