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科研机构
西安交通大学 [45]
内容类型
期刊论文 [45]
发表日期
2018 [45]
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发表日期:2018
专题:西安交通大学
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Advances in the Assembly Model of Bacterial Type IVB Secretion Systems
期刊论文
APPLIED SCIENCES-BASEL, 2018, 卷号: 8
作者:
Wang, Shan
;
Wang, Dan
;
Du, Dan
;
Li, Shanshan
;
Yan, Wei
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/11/19
T4BSS
mosaic architecture
core complex
Differences between the perspectives of physicians and patients on the potential barriers to optimal diabetes control in China: a multicenter study
期刊论文
BMC HEALTH SERVICES RESEARCH, 2018, 卷号: 18
作者:
Liu, Chun
;
Xu, Shaoyong
;
Ming, Jie
;
Jia, Aihua
;
Wei, Yingji
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/11/19
Diabetes control
Barriers
China
Cross-sectional study
Low specific on-resistance GaN-based vertical heterostructure field effect transistors with nonuniform doping superjunctions
期刊论文
CHINESE PHYSICS B, 2018, 卷号: 27
作者:
Mao, Wei
;
Wang, Hai-Yong
;
Shi, Peng-Hao
;
Wang, Xiao-Fei
;
Du, Ming
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/19
breakdown voltage
nonuniform doping superjunctions
GaN-based vertical HFETs
minimized specific on-resistance
Current Research Status of Phase Field Simulation for Microstructures of Additively Manufactured Metals
期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 页码: 1145-1150 and 1180
作者:
Geng, Ruwei
;
Du, Jun
;
Wei, Zhengying
;
Wei, Pei
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/19
Additive manufacturing process
Current research status
Fundamental principles
Metal additives
Micro-structure evolutions
Parameters determination
Phase field methods
Phase-field simulation
Effect of magnetron sputtering parameters on adhesion properties of tungsten-rhenium thin film thermocouples
期刊论文
Ceramics International, 2018, 卷号: 44, 页码: S15-S18
作者:
Tian, Bian
;
Yu, Qiuyue
;
Zhang, Zhongkai
;
Du, Zhe
;
Ren, Wei
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/19
Adhesion properties
Alumina ceramic substrates
Magnetron sputtering parameters
Optimal parameter
Orthogonal experiment
Orthogonal table
TFTCs
Thin film thermocouple
A Community Structure in Fully Signed Static Networks
期刊论文
Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University, 2018, 卷号: 52, 页码: 45-51
作者:
He, Xiaochen
;
Du, Haifeng
;
Du, Wei
;
Feldman, Macus W
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/19
Collective action
Community structures
Detecting methods
Index
Modularity
Network structures
Signed networks
Static networks
The Elucidation of Thickness Effect of Three-dimensional Fracture Toughness by Using the Finite Element Method 金属材料三维断裂韧度厚度效应的有限元模拟
期刊论文
Guti Lixue Xuebao/Acta Mechanica Solida Sinica, 2018, 卷号: 39, 页码: 170-181
作者:
Yu, Li
;
Lv, Junnan
;
Du, Wei
;
Li, Qun
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/11/19
Cohesive zone model
Finite element method
Fracture toughness
Thickness effect
Three-point bending
Advanced Treatment of Printing and Dyeing Wastewater by Adsorption Concentration-Fenton Oxidation Process
期刊论文
Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University, 2018, 卷号: 52, 页码: 158-164
作者:
Liu, Jing
;
Du, Jinfang
;
Wu, Jia
;
Feng, Jiangtao
;
Yan, Wei
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/11/19
Adsorption conditions
Advanced treatment
Concentrated solution
Fenton oxidation
Fenton oxidation process
Highest temperature
Printing and dyeing wastewaters
Secondary effluent
Study of high breakdown voltage GaN-based current-aperture vertical electron transistor with source-connected field-plates for power applications
期刊论文
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2018, 卷号: 33
作者:
Wang, Haiyong
;
Mao, Wei
;
Cong, Guanyu
;
Wang, Xiaofei
;
Du, Ming
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/11/19
source-connected field-plates
breakdown voltage
specific on-resistance
GaN-based CAVET
power device
Preliminary single event effect distribution investigation on 28?nm SoC using heavy ion microbeam
期刊论文
Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 2018
作者:
Yang, Weitao
;
Du, Xuecheng
;
Guo, Jinlong
;
Wei, Junze
;
Du, Guanghua
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2019/11/19
All Programmable SoC
Heavy ion microbeam
Layout information
Modern physics
On chip memory
Partial cross section
Single event effects
System on chips (SoC)
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