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Wafer-level Fabrication of Nanocone Forests by Plasma Repolymerization Technique for Surface-enhanced Raman Scattering Devices 期刊论文
Applied Surface Science, 2016
作者:  Mao HY(毛海央);  Wang WB(王玮冰)
收藏  |  浏览/下载：9/0  |  提交时间：2017/05/08
Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of gaas ccd 期刊论文
Microsystem technologies-micro-and nanosystems-information storage and processing systems, 2016, 卷号: 22, 期号: 8, 页码: 1983-1989
作者:  Ye, Jiaotuo;  Wang, Shuangfu;  Zhu, Chunsheng;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载：20/0  |  提交时间：2019/05/09
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Glass-SOI-Based Hybrid-Bonded Capacitive Micromachined Ultrasonic Transducer With Hermetic Cavities for Immersion Applications 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2016, 卷号: 25, 期号: 5
作者:  Miao, Jing;  Wang, Hui;  Li, Peng;  Shen, Wenjiang(沈文江);  Xue, Chenyang
收藏  |  浏览/下载：30/0  |  提交时间：2017/03/11
Fabrication of iridium oxide neural electrodes at the wafer level 期刊论文
science china technological sciences, 2016, 卷号: 59, 期号: 9, 页码: 1399-1406
ZHANG He; PEI WeiHua; ZHAO ShanShan; YANG XiaoWei; LIU RuiCong; LIU YuanYuan; WU Xian; GUO DongMei; GUI Qiang; GUO XuHong; XING Xiao; WANG YiJun; CHEN HongDa
收藏  |  浏览/下载：17/0  |  提交时间：2017/03/16

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