CORC

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CORC

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Research Progress on Sulfur-Induced Corrosion of Alloys 690 and 800 in High Temperature and High Pressure Water 期刊论文
ACTA METALLURGICA SINICA, 2017, 卷号: 53, 期号: 12, 页码: 1541-1554
作者:  Xia Dahai;  Song Shizhe;  Wang Jianqiu;  Luo Jingli
收藏  |  浏览/下载：22/0  |  提交时间：2021/02/02
Research Progress on Sulfur-Induced Corrosion of Alloys 690 and 800 in High Temperature and High Pressure Water 期刊论文
ACTA METALLURGICA SINICA, 2017, 卷号: 53, 期号: 12, 页码: 1541-1554
作者:  Xia Dahai;  Song Shizhe;  Wang Jianqiu;  Luo Jingli
收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
Microstructure and texture evolution of electrodeposited coatings of nickel in the industrial electrolyte 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2017, 卷号: 330, 页码: 170-177
作者:  Xu Yang-tao;  Dai Yu-jie;  Zhang Wei;  Xia Tian-dong
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/15
Influence of Nitrogen Vacancy Concentration on Mechanical and Electrical Properties of Rocksalt Zirconium Nitride Films 期刊论文
CHINESE ACAD SCIENCES, INST METAL RESEARCH, 2017, 卷号: 30, 期号: 11, 页码: 1100-1108
作者:  Han, Ke-Chang;  Lin, Guo-Qiang;  Dong, Chuang;  Tai, Kai-Ping;  Jiang, Xin
收藏  |  浏览/下载：225/0  |  提交时间：2018/01/10
Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
尼龙网方格沙障防护效应研究 学位论文
新疆乌鲁木齐: 中国科学院大学, 2017
作者:  黎小娟
收藏  |  浏览/下载：88/0  |  提交时间：2018/12/29
Sol concentration effect on ZnO nanofibers photocatalytic activity synthesized by sol–gel dip coating method 期刊论文
Materials Research Express, 2017, 卷号: 4
作者:  Toubane,M;  Tala-Ighil,R;  Bensouici,F;  Bououdina,M;  Souier,M
收藏  |  浏览/下载：4/0  |  提交时间：2020/10/21
Sol concentration effect on ZnO nanofibers photocatalytic activity synthesized by sol-gel dip coating method 期刊论文
MATERIALS RESEARCH EXPRESS, 2017, 卷号: 4, 期号: 3, 页码: 1-17
作者:  Toubane, M.;  Tala-Ighil, R.;  Bensouici, F.;  Bououdina, M.;  Souier, M.
收藏  |  浏览/下载：16/0  |  提交时间：2018/07/04
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5 Cu flip chip solder interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/03
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03

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