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CORC

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Thermoelectric Properties of Mg3(Bi,Sb)2 under Finite Temperatures and Pressures: A First-Principles Study 期刊论文
NANOMATERIALS, 2024, 卷号: 14, 期号: 1, 页码: 17
作者:  Peng Q(彭庆);  Ma, Xinjie;  Yang, Xiaoyu;  Yuan XZ(袁晓泽);  Chen, XiaoJia
收藏  |  浏览/下载：0/0  |  提交时间：2024/02/19
Lattice Thermal Conductivity of Mg3(Bi,Sb)2 Nanocomposites: A First-Principles Study 期刊论文
NANOMATERIALS, 2023, 卷号: 13, 期号: 22, 页码: 12
作者:  Peng, Qing;  Yuan, Xiaoze;  Zhao, Shuai;  Chen, Xiao-Jia
收藏  |  浏览/下载：0/0  |  提交时间：2024/01/08
Assessing Effects of van der Waals Corrections on Elasticity of Mg3Bi2-xSbx in DFT Calculations 期刊论文
MATERIALS, 2023, 卷号: 16, 期号: 19, 页码: 15
作者:  Peng, Qing;  Ma, Xinjie;  Yang, Xiaoyu;  Zhao, Shuai;  Yuan, Xiaoze
收藏  |  浏览/下载：7/0  |  提交时间：2023/11/13
Synergistic defect engineering for improving n-type NbFeSb thermoelectric performance through high-throughput computations 期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2022, 卷号: 10
作者:  Li, Jingyu;  Zhu, Jianbo;  Ti, Zhuoyang;  Zhai, Wenya;  Wei, Liuming
收藏  |  浏览/下载：14/0  |  提交时间：2022/12/23
Achieving higher thermoelectric performance of n-type PbTe by adjusting the band structure and enhanced phonon scattering 期刊论文
NANOSCALE, 2022
作者:  Wu, Wei;  Zhu, Chen;  Ming, Hongwei;  Chen, Tao;  Li, Di
收藏  |  浏览/下载：12/0  |  提交时间：2022/12/23
Thermoelectric properties of hole-doped CuRhO2 thin films 期刊论文
APPLIED PHYSICS LETTERS, 2022, 卷号: 121
作者:  Cheng, W. P.;  He, Y. D.;  Wei, R. H.;  Hu, L.;  Song, W. H.
收藏  |  浏览/下载：20/0  |  提交时间：2022/12/23
The controllable electronic characteristics and Schottky barrier of graphene/GaP heterostructure via interlayer coupling and in-plane strain 期刊论文
Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 2022, 卷号: 284
作者:  Lu, Xuefeng;  Li, Lingxia;  Guo, Xin;  Ren, Junqiang;  Xue, Hongtao
收藏  |  浏览/下载：15/0  |  提交时间：2022/08/09
Elasticity of Mg3Bi2-xSbx 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 20, 页码: 12
作者:  Peng Q(彭庆);  Zhao,Shuai;  Yuan XZ(袁晓泽);  Chen,XiaoJia
收藏  |  浏览/下载：11/0  |  提交时间：2022/11/21
High Thermoelectric Performance of Cu3SbSe4 Obtained by Synergistic Modulation of Power Factor and Thermal Conductivity 期刊论文
ACS APPLIED ENERGY MATERIALS, 2022
作者:  Ai, Li;  Ming, Hongwei;  Chen, Tao;  Chen, Ke;  Zhang, Jinhua
收藏  |  浏览/下载：11/0  |  提交时间：2022/12/22
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：15/0  |  提交时间：2022/08/09

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