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CORC

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Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
作者:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
收藏  |  浏览/下载：12/0  |  提交时间：2021/02/02
The dielectric, thermal properties and crystallization mechanism of Li-Al - B-Si - O glass - Ceramic systems as a new ULTCC material 期刊论文
CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 16, 页码: 19689
作者:  Chen, Guanyu;  Ma, Mingsheng;  Wei, Anqing;  Liu, Zhifu;  Zhang, Faqiang
收藏  |  浏览/下载：62/0  |  提交时间：2019/12/26
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
作者:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
作者:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02
High-performance oxygen reduction electrocatalysts derived from uniform cobalt-adenine assemblies 期刊论文
NANO ENERGY, 2015, 卷号: 17, 页码: 120-130
作者:  Shen;  Mengxia;  Zheng LR(郑黎荣);  Zheng;  Li-Rong
收藏  |  浏览/下载：21/0  |  提交时间：2016/04/18
High-performance oxygen reduction electrocatalysts derived from uniform cobalt-adenine assemblies 期刊论文
nano energy, 2015, 卷号: 17, 期号: 43, 页码: 120-130
作者:  Shen,Mengxia;  Zheng,Li-Rong;  He,Wenhui;  Ruan,Changping;  Jiang,Chunhuan
收藏  |  浏览/下载：30/0  |  提交时间：2016/04/29
Hot spots in photoreduced Au nanoparticles on DNA scaffolds potent for robust and high-sensitive surface-enhanced Raman scattering substrates 期刊论文
Materials Chemistry and Physics, 2013, 卷号: Vol.138 No.2-3, 页码: 573-580
作者:  Liu,Jinhuai;  Yang,Liangbao;  Lin,Dongyue;  Ma,Hongwei;  Zhang,Li
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/22
Electroless Cu deposition on a TiN barrier in CuSO4-HF solution 期刊论文
2010, 2010
Zhong, S; Yang, ZG; Cai, J; He, HJ; Wen, JS; Liu, C
收藏  |  浏览/下载：2/0  |  提交时间：2017/06/15
Super high speed polysilicon emitter integrated circuit technology 期刊论文
pan tao ti hsueh paochinese journal of semiconductors, 2001
Zhang, Li-Chun; Ni, Xue-Wen; Wang, Yang-Yuan
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/17
Diamond electronic packages featuring bonded metal 专利
专利号: WO1997005757A1, 申请日期: 1997-02-13, 公开日期: 1997-02-13
作者:  LEWIS, ELLIOTT;  KOBA, RICHARD;  WOODIN, RICHARD, L.
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/30

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