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STUDY ON DE-EMBEDDING APPROACH OF NON-COAXIAL MICROWAVE DEVICE TEST FIXTURES 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Chen, Shouhong[1];  Yang, Ping[2];  Ma, Jun[3];  Wang, Zhuang[4];  Yan, Xuelong[5]
收藏  |  浏览/下载:19/0  |  提交时间:2019/12/24


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